Thin-Film Chip Resistors Offer Many Values

Oct. 8, 2008
A miniature thin-film silicon wire-bondable resistor chip—the 110R—consists of a string of 20 resistors and 21 wire-bond pads that allow users to select from a wide range of values. The chip uses an advanced thin-film manufacturing technique and

A miniature thin-film silicon wire-bondable resistor chip—the 110R—consists of a string of 20 resistors and 21 wire-bond pads that allow users to select from a wide range of values. The chip uses an advanced thin-film manufacturing technique and features high-stability, self-passivating, and moisture-resistant tantalum nitride resistor elements. It is well-suited for developing quick-turn prototypes in hybrid microelectronics labs. A set of 10 2.5-kO resistors and a set of 10 25-kO resistors add up to 275 kO. Since the resistors are in series with pads between each, a designer can get any value between 2.5 kO and 275 kO. The 110R offers a temperature coefficient of resistance as low as 250 ppm/°C. The devices also feature low shunt capacitance and low-noise operation. Operating temperature range is ?55°C to 125°C. Samples are available now with lead times of six weeks for production quantities. Production prices range from $3.90 to $7.25, depending on tolerance and volume. ONCHIP DEVICES, Santa Clara, CA. (408) 540-6365.

Company: ONCHIP DEVICES

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