Yield-Modeling Platform Readies ICs For Tapeout

May 12, 2005
IC yields are becoming much more limited by process technology than by the IC designs themselves. And with each process generation, optimal yields have fallen progressively lower. Some experts expect that, without intervention, yields at 65 nm likel

IC yields are becoming much more limited by process technology than by the IC designs themselves. And with each process generation, optimal yields have fallen progressively lower. Some experts expect that, without intervention, yields at 65 nm likely will be in the single digits. Thus, a design-manufacturing gap has opened and is widening with each process generation.

Ponte Solutions believes the way to come at this problem is through visibility into yield problems at the design stage. To that end, the startup is planning its initial products around three core capabilities: a comprehensive unified yield-modeling platform, high-capacity data processing, and robust yield analysis.

Traditional design-for-yield methodologies have relied on rule-based, design-independent systems. Such rule-based approaches reflect neither process variations nor design specifics. Ponte's approach will be based on statistical yield models derived from its unified yield-modeling platform, which enables strong correlation with foundry results.

The unified models cover random and systematic defect types as well as catastrophic and parametric failures. They'll enable an expandable framework that supports third-party yield models.

Ponte's yield-analysis technology will handle custom and cell-based structures for accurate, full-chip analysis. It also will enable design-content-specific analysis for various defects in addition to "what-if" analysis scenarios. It's orders of magnitude faster than rule-based systems as well.

Ponte Solutions, which was formerly known as EZ-CAD, expects to launch its line of design-for-yield software tools by the end of 2005.

See associated figure

Ponte Solutionswww.pontesolutions.com
About the Author

David Maliniak | MWRF Executive Editor

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy. David earned a B.A. in journalism at New York University.

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