Heatsinks Fit BGA And Power PC Devices

Oct. 1, 1998

Available in 15 to 50 mm sizes for BGA, SBGA and PBGA devices and 21 and 25 mm sizes for Power PC devices, this new line of ChipCooler heatsinks offers a proprietary attachment system that allows the heatsinks to be attached to BGA or other style packages with a simple snap-on action. A threaded clip and screw-down assembly accepts a mating aluminum heatsink that screws into the clip, and the entire assembly snaps down and locks into place with a 90° to 180° turn.

About the Author

Staff

Articles, galleries, and recent work by members of Electronic Design's editorial staff.

Sponsored Recommendations

Comments

To join the conversation, and become an exclusive member of Electronic Design, create an account today!