Master Bond MasterSil 323S-LO is an addition cured silicone that is electrically and thermally conductive. This material is designed for bonding applications where low stress is critical and is appropriate for use in vacuum environments. It can withstand aggressive thermal cycling and mechanical shock, while offering a wide service temperature range from -80°F to +400°F [-62°C to +204°C].

XPedite2770 is a high-performance, reconfigurable, 3U VPX FPGA module based on the AMD Versal^® Prime Adaptive Compute Acceleration Platform (ACAP). With multiple high-speed fabric interfaces and 16GB of LPDDR4 ECC SDRAM in two channels, the XPedite2770 is ideal for customizable, high-bandwidth, signal-processing applications. It includes integrated security features to protect sensitive data.