Advanced RF pulsing, direct match-generator synchronization, and impedance-matching technology are critical to achieving precision in angstrom-scale semiconductor manufacturing.
A new graphene-based interconnect technology developed by Destination 2D promises to help ICs overcome the limitations imposed by today’s copper-based processes.
Designing and developing a product these days can be a challenge, made more difficult by new disruptive technologies, supply-chain issues, and a complex regulatory environment.
