Overcoming Challenges in Advanced Logic Semiconductor Manufacturing

Making logic chips has never been an easy task, and it’s been further challenged by advances in scaling as well as topologies like chiplets. From the race to 2-nm-foundry creation for next-generation wafer creation to the related issues of packaging, engineers must develop new solutions. This is especially significant in the development of chiplet package design and manufacturing technology for 2-nm semiconductors.

In this podcast, we talk to Henri Richard, GM and president of Rapidus Design Solutions, about the state of the art and the solutions his company is developing.