Making logic chips has never been an easy task, and it’s been further challenged by advances in scaling as well as topologies like chiplets. From the race to 2-nm-foundry creation for next-generation wafer creation to the related issues of packaging, engineers must develop new solutions. This is especially significant in the development of chiplet package design and manufacturing technology for 2-nm semiconductors.
In this podcast, we talk to Henri Richard, GM and president of Rapidus Design Solutions, about the state of the art and the solutions his company is developing.
