Ultra-Fast-Recovery Rectifiers Fit Inside a Thinner DPAK
Packaging is one of the most important factors to improving the performance of power electronics. To that end, Taiwan Semiconductor rolled out a family of ultra-fast-recovery Schottky rectifiers in a unique package called ThinDPAK. It has the same footprint as standard DPAKs but in a lighter, thinner (1.33 mm) form factor, offering superior power density and thermal dissipation.
With a maximum operating temperature (Tj, max) of 175°C and typical reverse-recovery time of 25 ns, the ThinDPAK family meets the need for more ruggedness and higher reliability in power electronics in cars. That includes high-frequency inverters, steering diodes in high-voltage systems, DC-DC converters, as well as freewheeling diodes, reverse battery protection, and lighting.
The planar Schottky topology of the new family offers high rectification efficiency that dissipates less heat than alternatives. For the heat that’s dissipated, the new series of ThinDPAK devices tamp down thermal resistance (Rj∅A) by more than 20%. Moreover, the devices save both weight and headroom compared to standard DPAKs.
Reverse-voltage (VVRRM) ratings range from 45 to 200 V DC with current ratings up to 150 A. The parts come in single and dual (common cathode) configurations.
