The DLCC Series ceramic diode leadless chip carrier devices are suitable for use in military, aerospace, avionics, and other high-temperature applications. Providing enhanced thermal performance and better solderability, the diodes reside in fully-hermetic, surface-mount ceramic packages designed to fit the standard solder footprint for existing MELF-type devices. Packaging design features of the DLCC Series diodes include thermal vias that improve heat transfer to the solder pads, reducing the diode’s junction temperature and increasing its operating lifetime. The package also features castellated terminations that ensure the solder meniscus between the PCB and the device is visible for inspection. TT ELECTRONICS PLC, Corpus Christi, TX. (361) 992-7900.
Comments