High-Density Board-to-Board Connectors Fit in Tight Spaces

This video is part of our TechXchange Talks Series.

Molex has introduced a new series of Quad-Row Board-to-Board Connectors that it hopes will set "a new connectivity standard for space optimization" by saving 30% more space compared to existing designs.

The connectors feature a unique layout that staggers the position of the pins across four rows, with a signal contact pitch of 0.175-mm, to deliver high-density circuit connectivity. At the same time, the parts align with a 0.35-mm soldering pitch that's standard for surface-mount technology (SMT).

The goal is to give consumer electronics firms more flexibility when it comes to designing smartwatches, augmented-reality (AR) devices, and other wearables. To discuss the technology in-depth, Electronic Design met with Kenji Kijima, director of mobile solutions at Molex.

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