High-Density Board-to-Board Connectors Fit in Tight Spaces

Aug. 25, 2022

A series of quad-row board-to-board connectors use staggered pins to save 30% more space compared to existing solutions.

James Morra

Related To: Electronic Design

This video is part of our TechXchange Talks Series.

Molex has introduced a new series of Quad-Row Board-to-Board Connectors that it hopes will set "a new connectivity standard for space optimization" by saving 30% more space compared to existing designs.

The connectors feature a unique layout that staggers the position of the pins across four rows, with a signal contact pitch of 0.175-mm, to deliver high-density circuit connectivity. At the same time, the parts align with a 0.35-mm soldering pitch that's standard for surface-mount technology (SMT).

The goal is to give consumer electronics firms more flexibility when it comes to designing smartwatches, augmented-reality (AR) devices, and other wearables. To discuss the technology in-depth, Electronic Design met with Kenji Kijima, director of mobile solutions at Molex.

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About the Author

James Morra | Senior Editor

James Morra is a senior editor for Electronic Design, covering the semiconductor industry and new technology trends, with a focus on power electronics and power management. He also reports on the business behind electrical engineering, including the electronics supply chain. He joined Electronic Design in 2015 and is based in Chicago, Illinois.