Electronic Design UPDATE: July 28, 2004

==================================

Electronic Design UPDATE e-Newsletter
Electronic Design Magazine 
PlanetEE ==> www.planetee.com
July 28, 2004
=============================


*************************ADVERTISEMENT**************************

SPONSORED BY: TRUE CIRCUITS, INC. 
True Circuits, Inc. offers a family of award-winning clock generator, 
deskew, low-bandwidth and spread-spectrum PLLs and DDR DLLs that spans 
nearly all performance points and features typically requested by ASIC 
and FPGA designers. These high-quality, low-jitter, silicon-proven hard 
macros are available for immediate delivery in a range of frequencies, 
multiplication factors, sizes and functions in TSMC, UMC and Chartered 
processes from 0.25um to 90nm.

Call (650) 691-2500 or visit 
http://lists.planetee.com/cgi-bin3/DM/y/eA0Gl4E70Fh108B30A2 

****************************************************************

Today's Table Of Contents:
1. Industry View
  * The Path Toward Analog/RF Subsystem Integration
2. Focus On Analog
  * Dual SPDT Switch Has Low On-Resistance, THD
3. News From The Editors
  * Bus Bridge Speeds PCI-X Data Traffic
  * IC Programmer Targets Notebook Systems
  * One Flip-Chip Provides ESD Protection Of 50 Discretes 
4. Upcoming Industry Events
  * IEEE Electromagnetic Compatibility Society Symposium
  * IEEE Product Safety Engineering Society Symposium
  * Embedded Software Development Conference
  * 24th International Display Research Conference and Fourth 
    International Meeting on Information Display
5. Magazine Highlights: July 19, 2004
  * Cover Feature: Technology Report -- Analog Front Ends Max Out 
    Performance
  * Leapfrog: First Look -- Instrument Advances Help Communications 
    Design
  * Leapfrog: First Look -- Low-Cost FPGAs Spin Out High Performance
  * Design View / Design Solution -- Using LCD Panels For TVs Takes 
    Technology To The Outer Limits

Electronic Design UPDATE edited by John Novellino, Executive Editor

****************************************************************

PHOTO ESSAY CONTEST: YOU CAN WIN $500!		 HURRY! HURRY! AUGUST 6 DEADLINE!
Electronic Design presents "A Day in the Life of an Electronics 
Designer" photo essay contest. Grab your camera and snap away to show 
the "guts and glory" of you (and your team) at work. We'll publish the 
winning photos as part of our September 13 YOUR Most Important Issue of 
the Year, our annual special edition focusing on EE career issues. You 
can win $500 for best photo series, $250 for best single photo, or $50 
if we use any of your photos in the issue.

Deadline for submissions is August 6. Be sure to include names and 
titles of all photo subjects, as well as company name and the type of 
work-in-process that the photo illustrates.
Submit photos digitally to: mailto:[email protected]
Or mail to: Mark David, Editor-In-Chief
Electronic Design, 45 Eisenhower Drive, Paramus, NJ 07652
Or call Mark at: (201) 845-2467 

*****

2004 BALLOT For Electronic Design's ENGINEERING HALL OF FAME
It's time to elect the Class Of 2004 to our Engineering Hall Of Fame. 
Here's your opportunity to vote for this year's inductees. Our ONLINE 
BALLOT allows you to vote for as many nominees as you deem worthy and to 
name your own candidates, too.

Go To Zoomerang ==> http://lists.planetee.com/cgi-bin3/DM/y/eA0Gl4E70Fh10BJtY0At

*****

BE SURE TO VISIT Electronic Design's Web site, where the power of 
Electronic Design is a mouse click away! Read our Web exclusives, enjoy 
our Quick Poll, discover Featured Vendors, access our archives, share 
viewpoints in our Forums, explore our e-newsletters, and more.

TAKE OUR CURRENT QUICK POLL:
Electronic Design's editors ask which SYSTEMS TECHNOLOGY you would 
prefer us to cover more extensively.

Go to Electronic Design ==> http://lists.planetee.com/cgi-bin3/DM/y/eA0Gl4E70Fh10BGmZ0Ak

****************************************************************
 
**********************
1. Industry View -- Exclusive to Electronic Design UPDATE
**********************

The Path Toward Analog/RF Subsystem Integration

By Paul Kempf, CTO and CMO, Jazz Semiconductor

Most of the industry press has been emphasizing a trend toward CMOS 
integration for precision analog and RF circuitry on a system-level 
chip. However, a different reality is evident when you take a look at 
what's inside mainstream electronic products: a number of chips made 
with different technologies needed to meet real-world requirements. Even 
the products shipped by the most well known CMOS-only companies 
typically contain multiple die using different technology generations to 
meet not only voltage and isolation requirements, but also to balance 
cost versus performance for each of the subsystem components.
   In the case of a wireless handset, attempts to integrate part of the 
analog subsystem into the digital baseband break the link between key 
system building blocks: power management, mixed-signal, transceiver, 
RF power control, and power amplifier. The industry roadmap does not 
provide a technology path for single-chip integration of all analog 
blocks in advanced CMOS. So while the digital subsystem can absorb 
the signal-processing requirements for new wireless standards and 
multimedia functions, integration of the analog subsystem is 
realizable in a silicon technology optimized to meet the analog and 
RF requirements at the best cost-versus-performance tradeoff.
   The current view that standard CMOS will do everything has been 
fueled by progress in the commercialization of system-on-a-chip CMOS 
designs for cable modem, Ethernet, Bluetooth, and other applications 
that require limited mixed-signal functionality in a predominantly 
digital design with significant signal processing and possibly 
embedded memory. Dual-gate oxide processes enabled the integration of 
analog circuits using standard architectures and extended 
mixed-signal design IP from 350 nm down to 180 nm and even 150 nm. 
Changes in the electrical characteristics of the thick-gate I/O 
transistors used for much of the analog circuitry from one generation 
to the next had only second-order effects.
   But 130-nm and 90-nm technologies introduced changes to the basic 
analog performance of the transistor, as well as to the materials 
used for the gate dielectric and interconnect. As a result, advanced 
CMOS technologies that provide comparable performance for primarily 
digital functions can behave very differently for analog functions. 
Portability of products between technologies, and even between fabs 
with nominally the same technology, has become more problematic for 
mixed-signal designs. Second-order parameters that are not routinely 
monitored make things worse for RF designs integrated in a standard 
technology optimized for digital performance. A trend toward 
digitization of analog functionality has mitigated some of these 
problems, but inefficiencies in adding MIPS to mimic analog circuits 
grow into power-hungry challenges at radio frequencies. 
   In addition to some interesting firsts that have been demonstrated 
for CMOS technology, a significant number of breakthrough products 
that make use of specialty silicon such as biCMOS, silicon-germanium 
biCMOS, and enhanced RFCMOS technology have been announced in recent 
months. On the near horizon, the premium board space created by the 
trend to include wireless local-area network, Bluetooth, TV tuner, 
and camera functionality in the handset will change the value 
equation for integration of power management, RF power control, and 
even power-amplifier blocks with the RF transceiver. 
   System complexity caused by the need for multistandard, multifunction 
support will clearly result in different device combinations that 
will benefit from integration. Opportunities to reduce footprint and 
system cost without sacrificing performance will drive innovation in 
both analog design and specialty process technology to make it 
happen. 
   The concept of a single-chip CMOS system for cable modems, Ethernet, 
Bluetooth, and other applications with physical interfaces that fall 
readily within the capability of mixed-signal CMOS design is 
compelling. But there is usually more of the system to consider 
before claiming single-chip capability. In addition, the mismatch in 
functional scaling requirements for digital CMOS versus analog/RF 
technology is growing with each generation of smaller geometry 
processes. Adding the complexity of full analog/RF requirements to 
next-generation CMOS platforms is a cost, complexity, and 
time-to-market burden that few will choose to bear. The basic 
economics of adding optimized process modules to lagging geometry 
processes to provide smaller die size for analog/RF functions will 
determine the success of specialty silicon on the path toward analog 
subsystem integration.

Paul Kempf  is chief technical officer and chief marketing officer of 
Jazz Semiconductor, Newport Beach, Calif. He can be reached at 
mailto:[email protected] 

To comment on this Industry View, go to Reader Comments at the foot of 
the Web page:  

Electronic Design UPDATE ==> 
http://lists.planetee.com/cgi-bin3/DM/y/eA0Gl4E70Fh10BKBB0Ah

****************************************************************

*************************ADVERTISEMENT**************************

LSI Logic's RapidChip Platform ASIC Seminar

Join LSI Logic and Synplicity for an FREE Platform ASIC seminar at a 
location near you. Learn the rationale for and scope of support behind 
RapidChip(TM) platform technology, in conjunction with Synplicity's 
Amplify RapidChip custom physical synthesis solution. RapidChip reduces 
design time, increases productivity, reduces risk, and lowers design 
costs,regardless of your application and specialization.

Seating is limited for this popular event, so check locations, dates and 
register now at: http://lists.planetee.com/cgi-bin3/DM/y/eA0Gl4E70Fh10BKBC0Ai

****************************************************************

**********************
2. Focus On Analog
**********************

***Dual SPDT Switch Has Low On-Resistance, THD
The FSA2257 dual single-pole double-throw (SPDT) analog switch offers 
bidirectional operation, allowing use as either a multiplexer or 
demultiplexer by select pins. The device's performance and small size 
suit it well for portable audio designs. A typical on-resistance of 0.95 
ohm reduces power consumption. Total harmonic distortion is only 0.002%, 
and operating range is a broad 1.65 to 5.5 V. Electrostatic discharge 
performance is 8 kV (using the human body model). A leakage current of 
only 2 nA and a low charge injection of 20 pC, max, minimize offset 
error in signal sample-and-hold applications. The switch comes in a 
10-terminal leadless MicroPak (L10X suffix) on 500-piece tape-and-reels 
compatible with standard high-speed manufacturing equipment. It is 
lead-free and complies with the joint IPC/JEDEC standard J-STD-020B and 
with European Union requirements effective next year. The FSA2257 costs 
$0.75 each in lots of 1000 and is available four weeks after ordering.
     Fairchild Semiconductor ==> 
http://lists.planetee.com/cgi-bin3/DM/y/eA0Gl4E70Fh10BKBD0Aj 

**********************
3. News -- From The Editors
**********************

***Bus Bridge Speeds PCI-X Data Traffic
The PI7C21P100 bus bridge facilitates faster connectivity between PCI-X 
buses while supporting the full 64-bit/133-MHz specification for PCI-X. 
On top of that, it's backward-compatible from conventional PCI down to 
32 bits/33 MHz. The two-port bus is pin-compatible with previously 
released bridges. Capabilities include dynamic prefetching control, 
configurable free space in the memory data FIFO, and 5-V tolerance in 
support of legacy products. Also, its high bandwidth helps eliminate the 
bottleneck of enterprise I/O-heavy systems. The PI7C21P100 PCI-X to 
PCI-X bridge can be used on cards that pack quad Gigabit Ethernet ports, 
quad Fibre Channel ports, dual and quad SCSI RAID controllers, high-end 
video/imaging systems, single-board computers, and many other 
applications. The bridge chip includes asynchronous mode support, and it 
can handle six secondary bus masters and up to eight active transactions 
in each direction. Housed in a 304-pin HPBGA package, the chip costs $55 
each in lots of 1000.
     Pericom Semiconductor Corp. ==> http://lists.planetee.com/cgi-bin3/DM/y/eA0Gl4E70Fh10BKBE0Ak 

***IC Programmer Targets Notebook Systems
The Model 866 universal device programmer works with a standard parallel 
printer port or a USB port (USB 1.1 and USB 2.0), making it suitable for 
programming, reprogramming, test, and repair of memory devices using 
most computers, including notebooks. It comes with a library of 12,438 
devices (9734 supported via USB). An included 48-pin ZIF socket 
eliminates the need for an adapter for any DIP device up to 48 pins. An 
extensive line of socket adapts is available to connect the programmer 
to just about any type of IC package. A built-in in-circuit serial 
programming (ISP) connector allows users to program ISP chips 
in-circuit. The Model 866 is available for immediate delivery and costs 
$995 with a power supply and parallel cable. 
     B&K Precision Corp. ==> 
http://lists.planetee.com/cgi-bin3/DM/y/eA0Gl4E70Fh10BKBF0Al 

***One Flip-Chip Provides ESD Protection Of 50 Discretes 
A flip-chip array that measures only 2.5 mm square and 0.65 mm high can 
eliminate up to 50 discrete components used to protect LCD interfaces 
from destructive electromagnetic fields and electrostatic discharges, 
according to its manufacturer. The LX7207 is a 5-by-5 array that 
supports up to 10 lines of integrated low-pass filters. It is equally 
suited for data-port and data-line protection in wireless handsets, 
notebook computers, PDAs, MP3 players, and portable terminals. Filter 
response is characterized to 6 GHz with more than 30-dB attenuation in 
the 800- to 1000-MHz range and 20-dB attenuation in the common wireless 
local-area network bands at 2.4 GHz and 5.0 to 6.0 GHz. The LX7207 costs 
$0.68 in quantities of 1000 to 5000. Samples and production quantities 
are available immediately.
     Microsemi Corp.  ==> 
http://lists.planetee.com/cgi-bin3/DM/y/eA0Gl4E70Fh10BKBP0Av 

**********************
4. Upcoming Industry Events
**********************

Aug. 9-13, IEEE Electromagnetic Compatibility Society Symposium 
(EMC2004)
Santa Clara, Calif.
http://lists.planetee.com/cgi-bin3/DM/y/eA0Gl4E70Fh10BKBG0Am 

Aug. 13-15, IEEE Product Safety Engineering Society Symposium
Santa Clara, Calif.
http://lists.planetee.com/cgi-bin3/DM/y/eA0Gl4E70Fh10BKBH0An 

Aug. 17-19, Embedded Software Development Conference
San Jose, Calif.
http://lists.planetee.com/cgi-bin3/DM/y/eA0Gl4E70Fh10BIPX0AH 

Aug. 23-27, 24th International Display Research Conference and Fourth 
International Meeting on Information Display
Daegu, Korea
http://lists.planetee.com/cgi-bin3/DM/y/eA0Gl4E70Fh10BKBI0Ao 

**********************
5. Magazine Highlights
**********************
In case you missed them, here are some of the high points of our most 
recent issue.

July 19, 2004:

* Cover Feature: Technology Report -- Analog Front Ends Max Out 
  Performance
These mixed-signal chips fit their target applications like a glove, 
speeding up system design and ultimately time-to-market.
http://lists.planetee.com/cgi-bin3/DM/y/eA0Gl4E70Fh10BKBJ0Ap

* Leapfrog: First Look -- Instrument Advances Help Communications Design
One company's horde of signal sources, enhanced analyzers, power meters, 
and connectivity test sets splashes down on IMS
http://lists.planetee.com/cgi-bin3/DM/y/eA0Gl4E70Fh10BKBK0Aq

* Leapfrog: First Look -- Low-Cost FPGAs Spin Out High Performance
Leveraging 90-nm process rules and a logic architecture that minimizes 
chip area, the Cyclone II FPGAs deliver a cost-sensitive, 
high-performance solution.
http://lists.planetee.com/cgi-bin3/DM/y/eA0Gl4E70Fh10BKBL0Ar

* Design View / Design Solution -- Using LCD Panels For TVs Takes 
  Technology To The Outer Limits
http://lists.planetee.com/cgi-bin3/DM/y/eA0Gl4E70Fh10BKBM0As

For the complete Table of Contents, go to 
Electronic Design ==> 
http://lists.planetee.com/cgi-bin3/DM/y/eA0Gl4E70Fh10BKBN0At


****************************************************************

YOUR CHANCE TO WIN $500! Take our ISSUE POLL and win a $500 gift 
certificate.
The editors would like to know what you think of the JULY 5 ISSUE of 
Electronic Design. Your feedback will help us better understand your 
critical information needs and provide valuable guidance for developing 
future editorial content. It's also your automatic entry into our 
drawing for a $500 American Express gift certificate. 

Go to ==> http://lists.planetee.com/cgi-bin3/DM/y/eA0Gl4E70Fh10BKBO0Au

****************************************************************
==================================

CONTACTS: Electronic Design UPDATE e-NEWSLETTER
==================================

Editorial: Lucinda Mattera, Associate Chief Editor:
mailto:[email protected]

Advertising/Sponsorship Opportunities: Bill Baumann, 
Publisher: 
mailto:[email protected]
==============================
You've received this e-newsletter for one of two reasons:
1) you subscribe to Electronic Design magazine
2) you've signed up for it at www.planetee.com

Please see below for unsubscribe and address-change instructions.

To subscribe, send a blank e-mail to:
mailto:[email protected]

To unsubscribe, send a blank e-mail to:
mailto:[email protected]