There have been some advancements in embedded technology despite the global pandemic, which has hindered chip production in everything from smartphones to video cards. Despite the shortage, manufacturers have managed to release new SBCs, SoCs, AIoMs, and other embedded systems. Most have been designed to take advantage of machine learning, Edge computing, and other AI applications, which is driving innovation in nearly every industry. In this roundup, we will take a look at several of the latest embedded technologies currently available in 2021.
AI-on-Module Designed for Industrial Applications at the Edge
Adlink Technology has launched its new LEC-IMX8MP SMARC AI-on-Module designed for industrial AI at the Edge applications. The new module is designed around NXP's i.MX 8M Plus SoC, which packs an Arm Cortex-A53 processor and integrated neural processing unit (NPU), providing up to 2.3 Terra Operations Per Second (TOPS). It also offers VDS/DSI/HDMI graphic output, dual CAN bus/USB 2.0/USB 3.0, dual GbE ports (one with TSN), and an I2S audio interface. The LEC-IMX8MP features BSP support for Debian, Yocto and Android, including MRAA hardware abstraction layer (HAL), and can operate in temperatures ranging from -40°C to +85°C.
New SoM Brings Edge Computing for Commercial Vehicles and Mobile Systems
MicroSys Electronics has launched its new MPXLX2160A, a ruggedized edge SoM (System on Module) designed for commercial vehicles and mobile systems. The SoM is designed around NXP's QorIQ Layerscape LX2160A processor, with an Arm Cortex-A72 and up to 128 Gb of DDR4 RAM. The board also packs 24X SerDes Lanes with PCIe Gen3 x8, 100GbE/40GbE/25GbE/10GbE, and SATA. Additional features include 2X RGMII, 2X USB 3.0, 2X CAN-FD, UART, I2C, and Flex SPI. The MPX-LX2160A can handle up to 256 Gb of eMMC storage, an interface for external SD cards, temperature sensors, RTC, Cooling Controller, and a JTAG debugging interface.
Semtech has announced sampling of its new GN2255 bidirectional 50Gbps PAM4 Tri-Edge CDR is now available. The GN2255 features an integrated DML laser driver to enable SFP56 50 Gbps PAM4 optical modules designed for 5G front haul deployment. The Tri-Edge IC features an ultra-low latency, with less than 1.5W per module and offers performance for up to a 10km reach with 50 Gbps PAM4 SFP56 optical modules. The IC has an industrial operating temperature range of -400C to 1000C and is being offered with an optional Reference Design Kit (RDK) with complete module-level firmware for rapid integration.
AI Vision Board Helps Engineers Accelerate Time to Market
ETA Compute recently announced its new integrated ECM3532 AI Vision Board designed to help developers accelerate time to market and quickly deploy machine-vision applications. The board is outfitted with an ECM3532 TENSAI SoC with an Arm Cortex-M3 microcontroller and a CoolFlux DSP to boost machine-learning operations. The board is also outfitted with several sensors (ambient light, microphone, accelerometer/gyroscope), a low-power Himax HM0360 camera, and an expansion connector. The ECM3532 has a CR2032 battery socket and uses low-power IoT/Bluetooth Low Energy connectivity, allowing the board to run for months before needing a recharge or battery replacement.
AI-Assisted Vehicle Computer get Upgraded for Increased Performance
Syslogic recently took advantage of Nvidia's Jetson Xavier NX module and incorporated it into its RS A3N AI vehicle computer, making it ideal for computer vision, inferencing, or sensor fusion applications, even in adverse conditions. With the Jetson Xavier NX module integrated into the RS A3N, the computer now features a 6-core Nvidia Carmel ARM v8.2 64-bit CPU with 384 CUDA cores and 48 Tensor cores, capable of pumping out 21 TOPS. It also includes 8 Gb of LPDDR4x RAM, a 7-Way VLIW vision processor, and a pair of NVDLA Engines. The computer comes equipped with a pair of Ethernet ports, CAN, USB 3.1 ports, and one HDMI interface. Two USB ports and a DisplayPort interface are also available behind the service cover and an M.2 slot (PCIe) to expand the flash memory from 125 GB to 2 TB. Connectivity options include LTE, GNSS, and Wi-Fi, and Syslogic is expected to expand the interface layout with PoE (Power over Ethernet) and digital I/Os in later revisions.
