What you'll learn:
- Insight into SK Hynix’s appearance at FMS.
- A sneak peek into the company's upcoming memory and storage solutions,
- SK Hynix's outlook on AI hardware advances.
SK Hynix displayed its next-gen memory and storage technologies at this year’s Future of Memory and Storage (FMS, formerly the Flash Memory Summit) exhibition held at the Santa Clara Convention Center in California. The company teased a few of its products beforehand, including new 12-layer HBM3E memory modules and the 321-layer 1Tb TLC NAND that's expected to ship in the first half of 2025.
Hynix took full advantage of the event, beginning with a keynote address highlighting its advances with AI memory solutions, such as the PCB01 SSD product line designed for on-device AI PCs. The SSD offers read and write speeds up to 14 GB per second, respectively, allowing for the operation of a large language model (LLM) for AI training and inference.
Unoh Kwon, Head of HBM Process Integration and Chunsung Kim, Head of SSD PMO, delivered a keynote speech on "AI Memory & Storage Solution Leadership and Vision for AI Era." The pair of executives introduced the company's DRAM and NAND product portfolios and AI memory solutions optimized for AI implementation.
With increasing demand for AI solutions, SK Hynix was recently granted a preliminary memorandum of terms from the U.S. Department of Commerce to provide up to $450 million in direct funding. An additional loan of up to $500 million supports high-bandwidth-memory (HBM) production and advanced packaging research and development for AI supply-chain security in the U.S.
SK Hynix has positioned itself as a leading provider of both NAND flash and DRAM. Both of its NAND and HBM innovations will help to facilitate the creation of next-generation AI hardware. AI workloads are very memory-intensive, and that makes memory advances a cornerstone in the advancement of AI-enabled hardware.
"With the AI era opening in full, the importance of memory solutions, a combination of multiple products to increase performance, instead of single DRAM and NAND products, is growing," said Justin Kim, President and the Head of AI Infra at SK Hynix. "At FMS, we will imprint our competitiveness and technological leadership in the global market."
