What you’ll learn:
- Where ceramic packaging and substrates are employed.
- Why designing solutions with ceramic packaging and substrates is challenging.
Ceramic packaging and substrates address high-performance and reliability requirements for many electronic applications, especially those found in rugged systems or where consistency and reliability are critical factors. This is particularly apparent in the RF and microwave space.
Remtec uses a proprietary technology called plated copper on thick film (PCTF). It can deliver high levels of product uniformity, yield consistency, and reliability. I talked with Remtec’s President, Brian Buyea, about the company’s offerings and the challenges and advantages of using ceramic technology in electronic devices (watch the video above).
Remtec provides a range of ceramic-based solutions from circuit boards and modules (see figure) to standard TO-style, surface-mount-technology (SMT) packages. Laser and photodiode submount assemblies leverage the company’s PCTF technology with a direct-bond-copper (DBC) metallization option, too. Most of the work is customized to accommodate solutions as well as materials and chips supplied by the customer for packaging.
The company also has subject-matter experts to assist in the design of systems, including testing and quality control.
