Molex Flex Circuit Assemblies Deploy DuPont™ Pyralux® TK Flexible Circuit Material

Molex Inc. has introduced new High-Speed Low-Loss Flex Circuit Assemblies, made using DuPont™ Pyralux® TK flexible circuit material.  The assemblies are ideal for electronic data transmission applications such as servers and high-end computing, storage servers and signal processing.

With this release, Molex has become one of the first manufacturers to incorporate DuPont™ Pyralux® TK flexible circuit material into the volume production of multi-layer flexible circuit constructions.  Pyralux® TK is a double-sided flexible copper clad laminate and bonding film system formulated with DuPont™ Teflon® fluoropolymer film and DuPont™ Kapton® polyimide film.  It provides exceptional electrical performance for high speed digital and high frequency flexible circuit applications. The dielectric constant and low-loss capabilities of Pyralux® TK deliver a mechanically flexible construction, tighter bend radii and faster transmission than standard flexible assemblies.

Molex High-Speed Low-Loss Flex Circuit Assemblies are available with self-coiling or mechanically-assisted coiling, offering options for flexible three dimensional packaging, minimizing insertion loss and providing improved airflow compared to a standard PCB design.