Pulsed RF Power for Angstrom-Scale Processes (Download)

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As the semiconductor industry enters the Angstrom Era, with 2-nm process nodes nearing mass production, new challenges in precision and process control emerge. Advances in RF power delivery, including RF pulsing and direct match-generator synchronization, are critical to overcoming these challenges and pushing chip manufacturing into sub-nanometer scales.

Propelled by the relentless pursuit of smaller, faster, more efficient chips, the semiconductor industry is approaching an inflection point, manufacturing at sub-nanometer—or angstrom (Å)—scale geometries. Several leading companies in the industry will enter mass production for their 2-nm processes next year, just four years since the first such chips were fabricated in 2021.