Powerex QID3320004 Attains UL Recognition

This Dual IGBT HVIGBT module makes use of the latest Mitsubishi R-Series chip technology, which offers lower losses, a more rugged SWSOA and RRSOA, and a higher current handling capability as compared to previous generations of chip technology.

Highly insulated housings offer enhanced protection by means of greater creepage and strike clearance distance for demanding applications such as medium voltage drives and auxiliary traction.

All components and interconnects are isolated from the heat sinking baseplate, offering simplified system assembly and thermal management.

• Product Ratings and Characteristics: This device is rated at 200A/3300V.
• Applications: These modules are designed primarily for medium voltage drive applications.