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Boréas Technologies produces a range of low-power piezo drivers for mobile haptic applications such as smartphones and handheld gaming devices. The BOS1901 high-voltage, low-power piezo driver is one example that's highlighted by Marc-Andre Morin is this video.
The BOS1901 (see figure) can drive 100 nF at 190 V p-p and 300 Hz using only 350 mW of power. It can handle a drive capacitive load up to 820 nF and supports energy recovery. In addition, the driver has an integrated digital front end with SPI interface. The chip includes a 64-sample internal FIFO Interface. Startup is under 300 µs.
The WLCSP chip has a 2.1- × 2.2-mm footprint and is also available in a QFN 4- × 4-mm package.
Links
- Boréas Technologies
- BOS1901 high voltage, low power piezo driver
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