Rudolph Technologies Inc. announced today that a major outsourced assembly and test (OSAT) manufacturer has placed a $12 million order for a follow-on JetStep advanced packaging lithography system and multiple NSX inspection systems for use in planned capacity expansion. The tools, which will ship this quarter and next, will be used in high-performance fanout wafer level packaging (FOWLP) applications.
“The JetStep System will be equipped with new hardware and software features that significantly increases our industry-best productivity. These upgrades will also be applied to the existing installed base, providing our customer with a significant capacity increase at a best-in-class cost-of-ownership,” said Rich Rogoff, vice president and general manager of Rudolph’s Lithography Systems Group. “The JetStep System continues to be the clear choice for advanced packaging fan-out wafer level processes due to its ability to handle warped wafers with varying die placement.”
“In addition to lithography, we are pleased to supply the latest 2D and 3D inspection and metrology solutions for the same FOWLP applications,” added Mike Goodrich, vice president and general manager of the Rudolph’s Inspection Business Unit. “Our newest NSX Systems offer the fast, reliable inspection and metrology needed for demanding advanced packaging applications, such as photoresist thickness and redistribution layer (RDL) and under bump metallization (UBM) height measurements.”
Further enhancing both the JetStep System and the NSX Systems is Rudolph’s Discover yield management software, which enables yield improvement through real-time analysis for faster solutions, increasing the productivity of each tool and the overall fab yield.
The JetStep advanced packaging lithography systems have been specifically designed to meet the challenges of back-end manufacturing. The systems address the needs of both the existing flip-chip processes (bump and copper pillar), as well as emerging processes, such as fan-out wafer level packaging, interposers, and 3D approaches. The JetStep system is unique in its ability to not only handle standard wafers, but also a wide range of substrates and sizes with significant process-induced warp, while being capable to print fine features for large packages such as interlopers in a single shot. With these capabilities, the system provides the flexibility to meet the diverse manufacturing requirements of advanced packaging with superior throughput when compared to legacy lithography tools initially designed for the front-end, wafer-based processes.
