Semi 200 Mm Fab

SEMI releases ‘Global 200-mm Fab Outlook to 2018’

Oct. 19, 2015

San Jose, CA. SEMI today published a new report, “Global 200-mm Fab Outlook to 2018.” According to the report, worldwide 200-mm semiconductor wafer fab capacity is forecast at 5.2 million wafer starts per month (WSPM) in 2015 and expanding to 5.4 million WSPM in 2018.

Based on the rapidly increasing number of Internet-enabled mobile devices and the emergence of the IoT (Internet of Things), demand for sensors, MEMS, analog, power, and related semiconductor devices is growing, SEMI said. While these devices are critical to enable the new era of computing, the applications do not require leading-edge manufacturing capability, and this demand is “breathing new life” into 200-mm fabs.

Here are some highlights of the results of the SEMI 200-mm report:

  • 36 facilities are expected to add 300,000 to 400,000 200-mm WSPM from 2015 through 2018.
  • Capacity investment is expected to total over US $3 billion during the 2015 to 2018 period.
  • Eight new facilities/lines are expected to begin operation from 2015 through 2018.
  • China and Southeast Asia are forecast to lead the expansion in 200-mm fab capacity.

In this report, SEMI covers nearly 200 facilities using 200-mm wafers, including facilities that are planned, under construction, installing new equipment, active, closing, or closed, and fabs changing wafer size to and from 200 mm. Analysis covers the years 1995 to 2018, with focus on developments in the recent past through 2018. The 80-page SEMI report offers graphs and tables in PDF slide format and details in Microsoft Excel. In addition, the report includes trend analysis for fab capacity and count, capacity additions for new and existing fabs, capacity loss for fabs closing or converting to other wafer sizes, 200-mm equipment spending, and summary and highlights for each region.

SEMI is also offering two complimentary webinars (November 2 at 5:00 p.m. Pacific and November 3 at 8:00 a.m. Pacific) with highlights of the newly released 200-mm report. Lead analyst Christian G. Dieseldorff will share highlights.

For more information, download the Global 200-mm Fab Outlook sample report.

About the Author

Rick Nelson | Contributing Editor

Rick is currently Contributing Technical Editor. He was Executive Editor for EE in 2011-2018. Previously he served on several publications, including EDN and Vision Systems Design, and has received awards for signed editorials from the American Society of Business Publication Editors. He began as a design engineer at General Electric and Litton Industries and earned a BSEE degree from Penn State.

Sponsored Recommendations

Comments

To join the conversation, and become an exclusive member of Electronic Design, create an account today!