Fairchild launches 1,200-V SiC diode

March 15, 2016

San Jose, CA. Fairchild released its first 1,200-V silicon carbide (SiC) diode, the FFSH40120ADN, in its series of upcoming SiC solutions. The 1,200-V diode’s combination of superior switching performance, higher reliability and low electromagnetic interference (EMI) make it ideal for next-generation solar inverters, industrial motor controls and welders which are all increasingly required to be more energy efficient at higher power densities.

“The combination of market trends and tightening industry standards is driving the need for more energy efficient products and our new 1,200-V SiC diode is designed specifically to help manufacturers achieve these ever-greater efficiency requirements and with better reliability, ruggedness and cost efficiency,” said Jin Zhao, vice president and general manager of Fairchild’s high power industrial division. “We based this diode on silicon carbide due to the material’s considerable advantages over silicon, and we will add additional SiC-based semiconductors as we build a comprehensive family of SiC solutions.”

The company says the FFSH40120ADN diode has the best leakage current performance in its class, leaking less current than its competitors at temperatures up to 175°C. The key benefits of this 1,200-V SiC diode include its fast switching and no reverse recovery current, which reduces switching losses compared to silicon and results in superior energy efficiency. Faster switching also allows manufacturers to reduce the size of their products’ magnetic coils and associated passive components, which improves packaging efficiency, reduces system weight and can reduce bill-of-materials (BOM) costs.

The diode’s ability to switch stably over a wide temperature range is another factor contributing to its exceptional performance, as is its zero recovery voltage which eliminates voltage overshoots.

The FFSH40120ADN diode also offers greater ruggedness and reliability compared to equivalent silicon-based diodes due to SiC having superior thermal performance to silicon. The breakdown field of SiC is 10x higher than that of silicon and SiC also has 3x greater thermal conductivity.

Fairchild will demonstrate the performance of the new 1,200-V SiC diode at the upcoming APEC conference, March 20-24 in Long Beach, CA.

http://blog.fairchildsemi.com

About the Author

Rick Nelson | Contributing Editor

Rick is currently Contributing Technical Editor. He was Executive Editor for EE in 2011-2018. Previously he served on several publications, including EDN and Vision Systems Design, and has received awards for signed editorials from the American Society of Business Publication Editors. He began as a design engineer at General Electric and Litton Industries and earned a BSEE degree from Penn State.

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