+180C. The socket also features an IC guide for precise LGA edge alignment. The specific configuration of the package to be tested in the CBT-LGA-5019 is LGA, 33-mm x 33-mm body size, 32 x 32 array, and 1-mm pitch. To use, drop IC into the socket, attach heatsink lid by tightening four screws. Vertical force is applied by the integrated compression plate between the heat-sink lid and device. This socket can be used for device characterization, screening, and custom burn-in applications.
The CBT-LGA-5019 socket features a contact design with outside spring and flat stamped plungers that provide a robust solution for burn-in and test applications including the electrical signal-integrity performance to meet the requirements of today's demanding analog, digital, RF, Bluetooth, and medical-device applications. The socket is mounted using supplied hardware on the target PCB with no soldering. The smal footprint allows inductors, resistors, and decoupling capacitors to be placed close to the device for impedance tuning. The heat-sink socket lid incorporates a quick installation method so that ICs can be changed out quickly.
Pricing for the CBT-LGA-5019 is $1,523 in unit quantities.
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