The XA-160M, a new PCIe XMC I/O module from Innovative Integration, features two 16-bit, 160 MSPS A/D channels and two 16-bit, 600 MSPS DAC channels. Designed for high speed stimulus-response measurements, ultrasound, high speed servo controls, AWG, RADAR, LIDAR and optical servo medical scanning, the module integrates an Xilinx Artix-7 FPGA device to implement data acquisition control, signal processing, buffering and system interface functions.
Flexible trigger methods include counted frames, software triggering and external triggering. The sample rate clock is either an external clock or on- board programmable PLL clock source. Two 256Mx16 memories provide data buffering and FPGA computing memory. The logic can be fully customized with Innovative’s FrameWork Logic toolset and either HLS or VHDL within Xilinx Vivado. Alternately, the MATLAB BSP supports real-time hardware-in-the-loop development using the graphical, block diagram Simulink environment with Xilinx System Generator. The PCIe 2.0 interface supports continuous data rates up to 3,200 MB/s between the module and the host. The XA-160M XMC I/O module measures 75 x 150 mm and offers 2.4 Vpp input, 1 Vpp output ranges.
Polytron Devices is offering two new series of universal input ac-dc switching power supplies for use in medical applications. The MUI40 single output and MUI65 dual and triple output devices boast 0.15 W low standby power consumption, 85 to 264 Vac, 47 to 63 Hz voltage range and low leakage current under 75 µA. Both power supplies integrate a built-in class B EMI filter, 2MOPP insulation and 5,000 M operating altitude. They are RoHS-compliant and meet medical electrical safety standards including ANSI/AAMI ES60601-1, EN6060-1 and IEC60601-1 3rd edition.
The MUI40 single output series, intended for applications up to 40 W, is available now in a 2" x 3" package, priced at $42.50 each/1,000. The MUI65 dual and triple output series, offering ultra low cross regulation under 1.5% for use in applications up to 65 W, is available now in a 2" x 3.5" package, priced at $79 each/1,000. Small quantity orders are available immediately, while larger orders have a lead time of 4 to 6 weeks.
The DG series of glass-encapsulated thermistors from Ametherm provide long-term stability and reliability for high-accuracy temperature sensing in automotive and industrial applications. Hermetically sealed, the thermistors eliminate errors in resistance readings due to moisture penetration while offering high operating temperatures and a compact size. The devices are free from limitations due to solder temperature, which enables them to offer a wide operating temperature range of -55°C to +200°C. With 1.5 mm diameters, the devices allow for encapsulation in a variety of housings, such as ring lugs and hex nuts.
The thermistors are available in four resistance values at 25°C: 10, 40, 50 and 100 kΩ, with tolerances down to ±2%, a dissipation constant of 3.0 mW/°C and thermal time constant of 6 s. The devices provide: TCRs of -3.9%/°C, -4.40%/°C and -4.75%/°C; beta values of 3,500°K, 3,950°K and 4,200°K; and 32 AWG dumet wire leads. Samples and production quantities of the DG series of glass-encapsulated thermistors are available now, with factory lead times of six to eight weeks. Volume pricing for U.S. delivery starts at $0.41 each.
TDK’s new ultra-thin PiezoHapt actuator, featuring a response time of 4 ms., has a unimorph design consisting of a multilayer piezo element bonded to one side of a vibration plate. With a thickness of 0.35 mm the haptic actuator is thinner than conventional eccentric rotary motors and linear resonant actuators, and due to its fast rise time, it reduces power consumption.
The actuator can be driven with low voltages of ≤24 V and can produce a variety of vibration patterns, depending on the amplitude and frequency of the voltage applied. The PHUA8060-35A-33-000 type has a footprint of 80 x 60 mm (vibration plate). At a frequency of 200 Hz (sine-wave) and a voltage of 24 V peak, the component offers a typical displacement of 55 µm. PiezoHapt actuators are suitable components for providing haptic feedback to user actions in the displays of mobile devices, car navigation systems, touch pads and controllers. Shipments of samples will begin in March 2017.
The Inforce 6640, Inforce Computing’s next generation Pico-ITX SBC featuring the Qualcomm Snapdragon 820 processor, optimizes the connectivity, performance, power and graphic capabilities required for virtual/augmented reality, healthcare, gaming, 4K video collaboration, cameras and IoT.
The Snapdragon 820 processor combines the Qualcomm Adreno 530 GPU, Qualcomm Hexagon 680 DSP and Qualcomm Spectra 14-bit dual-ISP with 25 MP @ 30 fps. The Qualcomm Kryo CPU is a quad-core configuration, clocked at up to 2.2 GHz.
The new Pico-ITX SBC features: 4 GB LPDDR4, 64 GB UFS 2.0 and 1 µSD card interface (other memory configurations available); dual MIPI-DSI, HDMI 4K Ultra HD HEVC video capture and playback; MIPI-CSI up to 25 MP camera; Bluetooth 4.2 LE, Wi-Fi 802.11ac, GbE and on-board GPS; and Android Marshmallow. Available accessories include the ACC-1H70, a 21MP complete camera card, and the ACC-1S70, a PoE accessory card allowing both power and Ethernet connection through a single cable.
Support for hardware customization and custom drivers, OS and I/O development allow specialized requirements to be met. The Inforce 6640 Pico-ITX SBC is priced at $295, with volume pricing available.
Two new ready-to-use prototype boards designed by STMicroelectronics for evaluating LoRaWAN and other LPWAN technologies including 6LoWPAN, offer a small footprint and power consumption in the range of 1.2 µA in standby mode. The products support industry-standard protocols, as well as proprietary LPWAN protocols for long-range connection of IoT devices like smart meters, alarm systems, positioning devices and sensors.
The B-L072Z-LRWAN1 STM32 LoRa Discovery kit builds on Murata’s open module that integrates a STM32L072CZ MCU, Semtech SX1276 transceivers. A LoRa modem provides ultra-long-range spread-spectrum communication and high interference immunity whilst minimizing current consumption. The open module offers access to the STM32L072 MCU and peripherals such as ADC, 16-bit timer, LP-UART, I2C, SPI and USB 2.0 FS. STM32L0 HAL and LL embedded software libraries are available, and support is provided for STM32 Nucleo or Arduino expansion boards. An on-board debugger, a 64-pin STM32 Nucleo morpho connector, an Arduino-compatible connector and a battery socket are included.
The I-NUCLEO-LRWAN1 is an STM32 Nucleo or Arduino expansion board for developing full LoRa-based and/or FSK/OOK connectivity applications. The board features a LoRaWAN module from USI together with an STM32L052T8 MCU and Semtech SX1272 transceivers, and is equipped with ST’s LIS2DS12 3-axis accelerometer, LPS22HB MEMS pressure sensor and HTS221 humidity-and-temperature sensor.
The B-L072Z-LRWAN1 Discovery kit ($46.50) and the I-NUCLEO-LRWAN1 ($25), are available from distributors now.
Twin Oaks Computing’s new CoreDX DDS middleware cross-platform, cross-language IPC library provides high-performance with low latency to support real-time control, and high message throughput to support high bandwidth data. The library boasts secure, robust, flexible and dynamic data communications, and features a small footprint from every angle: small library size, low line of code count and minimum run-time memory footprint. Based on Open Standards for guaranteed interoperability and long term viability, the IPC library is targeting distributed software programs such as mobile games, consumer devices, robots, surgical equipment, health care applications and DoD systems.
The Data Distribution Service architecture provides high performance data messaging for domains such as energy, industrial control, tactical and financial. Essential for effective Open System architectures and the IIoT, the new library provides features difficult to implement by hand, and not found in other IPC libraries. CoreDX DDS allows software systems to be extended and modified, even after deployment, with little or no change required to application software.
Microchip’s new zigbee alliance certified zigbee platform with zigbee PRO and Green Power features improves interoperability and lowers latency. The software stack, and corresponding BitCloud 4.0 SDK, are offered for the design of home automation, commercial lighting, smart energy and IoT applications.
The zigbee certified software enables cross-functional device support and will be backward-compatible with existing zigbee certified products. Low latency suitable for RF remote applications, mesh networking for large networks such as lighting applications, and the Green Power benefits of an energy harvesting switch are provided. The zigbee PRO Green Power feature enables battery-less devices to securely join a network while leveraging eco-friendly energy sources such as light, vibration or motion. Additionally, zigbee Light Link and zigbee Home Automation device types are fully supported.
The BitCloud 4.0 SDK enables application development on the SAM R21 Xplained Pro Evaluation Kit, a Cortex M0+-based 32-bit MCU with an integrated 2.4 GHz 802.15.4 compliant radio. When used with the newly certified software stack, the SDK provides a complete zigbee certified development platform. The ATSAMR21-XPRO Xplained Pro evaluation kit is available starting at $58, and the ATSAMR21ZLL-EK zigbee Light Link evaluation kit at $92.
Traco Power is now offering the TMF family of miniaturized encapsulated ac/dc power supplies with IEC/EN/ES60601-1 2xMOPP safety approvals and ISO 14971 Risk Management File. The fully encapsulated modules in plastic casing are designed for PCB mount applications, and come in 5 W, 10 W, 20 W and 30 W power classes with fixed output voltages of 5, 12, 15 and 24 Vdc.
Protection class II prepared, the products provide protection against short-circuit, over load and over voltage. Featuring low leakage current below 100 µA, -25 to +70°C operating temperature range, 90 - 264 Vac universal input, Class B rated EMI/EMC and miniature size (30 W models measure 2.50" x 1.80" x 0.93"), the power supplies are designed for in stationary and portable healthcare applications.
The TMF family of miniaturized encapsulated ac/dc power supplies are in stock and available through distributors with manufacturing lead times of 8 weeks. Pricing is $29.70 each/100 for the TMF 05, and $42.95 each/100 for the TMF 30.
Vicor is expanding its DCM series of dc-dc converters to utilize the VIA power packaging format. The modular dc-dc converter in a VIA package is ruggedized and operates from an unregulated, wide range input, to generate an isolated and regulated high efficiency output, boasting higher power densities than competitive products. The new converters improve BRICK with their enhanced functionality of EMI filtering, transient protection, inrush current limiting and a secondary-referenced control interface for trim, enable and remote-sensing. Configurations are available for both on-board mounting and for chassis mounting.
Aimed at applications in industrial and communications markets, Vicor has added two new models: a 48 V input nominal module (36 V - 75 V range) in a 3414 VIA package (3.38" x 1.40" x 0.37") with a 28 V / 320 W output; and a 300 input nominal module (200 - 420 range) in a 3714 VIA package (3.75" x 1.40" x 0.37") with a 28 V / 500 W output, achieving a power density up to 257 W/in3.
Whether you're looking for thermristors or actuators, Electronic Design has you covered. We've rounded up some of the latest products to help optimize your applications, devices, and systems.
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