TDK Corporation is expanding its series of rugged power inductors with devices in three new sizes. The CLF5030NI-D measures 5.0 x 5.3 x 2.7 mm, the CLF10060NI-D is sized at 10.0 x 10.1 x 6.0 mm and the CLF12577NI-D is 12.5 x 12.8 x 7.7 mm. The power inductors are designed for use in automotive electronics to provide a high level of efficiency and reliability over a temperature range extending from -55 °C to +150 °C, and have rated inductance values from 1.0 to 470 μH.
TDK uses an advanced materials technology that boasts outstanding heat resistance, and their new bonding process for the terminals enables a solderless structural design that features improved mechanical strength. The fully automated manufacturing process ensures the high level of reliability and quality of the components, suiting them for applications in demanding automotive environments such as the power supply circuits of engine control modules and ECUs for airbags, ABS, headlights and advanced driver assistance systems.
Qualified to AEC-Q200, the CLF5030NI-D, CLF10060NI-D and CLF12577NI-D rugged power inductors are set to begin mass production in October 2016.
The CS47L90 is Cirrus Logic's ultra low power high-fidelity smart audio codec offering new innovative voice features to mobile devices, such as “always on” voice activation, noise reduction, active noise cancelation, echo cancelation and speaker protection features, while delivering enhanced noise-free audio. The codec utilizes SmartHIFI, a combination of powerful DSP processing and high-performance analog circuits, to deliver an audio experience typically associated with high-end audio equipment, now optimized for mobile audio playback.
Featuring a 975 MIPS multi-core audio signal processor with advanced clocking architecture and a high performance 4 channel ADC/8 channel DMIC 24-bit hi-fi audio codec embedded with SoundClear technology, the codec is supported on multiple application processor platforms. Supporting 32-bit audio playback and integrating low series resistance and low jitter clock circuits, the CS47L90 smart codec is designed to ensure that the hi-fi DAC and headphone amplifier circuits deliver a clean, transparent audio signal with flat frequency response all the way to the output of the headphone.
Microsemi Corporation's new family of network synchronization PLLs for SyncE, IEEE 1588 and OTN, miTimePLL, boasts one third the jitter and half the footprint of current devices. The reduced jitter and footprint combined with the new miTimePLL technology is specifically designed to enable the devices to provide advanced network synchronization capabilities for phase alignment specifically for networks such as wireless infrastructure.
The ZL307xx, ZL3060x and ZL3061x family of network synchronization PLLs offers 180 fs typical jitter, ensuring a single chip, small footprint solution for 10 to 100 GbE applications. The devices come with new features vital for network applications requiring phase alignment, including: any-to-any frequency; better than 2 ns I/O alignment; ePPS; ToD registers; reference and synchronization inputs; and full monitoring and hitless reference switching between GPS/SyncE/1588. Microsemi's ePPS is providing a solution for chassis systems with limited backplane pins by combining phase into a high speed clock, thereby using a single pin, where two were required previously.
The new family of network synchronization PLLs for SyncE, IEEE 1588 and OTN are available now.
Pentek's new Jade family of XMC products is based on the Xilinx flagship Kintex UltraScale FPGA, which significantly raises DSP performance while also reducing power dissipation from previous design architectures. The UltraScale FPGA site can be populated with a choice of FPGAs spanning the KU035 through KU115.
The Jade architecture organizes the FPGA as a container for data processing applications where each function exists as an IP module. The Navigator Design Suite, designed from the ground up to work with the Jade architecture, consists of two components: Navigator FDK for integrating custom IP into Pentek sourced designs and Navigator BSP for creating host applications.
The first product to be introduced using the Jade architecture is the Model 71861. Designed for air-cooled, conduction-cooled and rugged operating environments, the XMC module has four 200 MHz A/D channels and programmable multiband DDCs. In addition to XMC, the product is also available in PCIe, 3U & 6U VPX, AMC, and 3U & 6U cPCI form factors, with versions for both commercial and rugged environments.
Work can begin immediately with an 8266 SPARK PC, 8264 SPARK 6U VPX or 8267 SPARK 3U VPX development system. The Jade Model 71861 is priced starting at $10,995. The Navigator BSP costs $2,500 and the Navigator FDK is $3,500.
Tianma NLT is adding six new 5.7" TFT LCD modules to their line of industrial displays developed by NLT Technologies – four VGA models and two QVGAs. NLT’s next generation 5.7" displays feature a built-in LED driver board, -30°C to +80°C operating temperature range and 900:1 contrast ratio. The six products are interchangeable with all having the same module outline and mounting hole positions. Five of the new displays have CMOS interfaces, and one of the VGAs has an LVDS interface.
The four 5.7" VGA modules include LVDS and CMOS interface models, standard and high brightness models, and a portrait view compatible model. They are resistant to vibrations up to 6.8 G, targeting them for applications prone to strong shock and vibration such as construction and marine equipment.
The 5.7" QVGA models include two QVGA models: a standard brightness model, and a high brightness model that achieves excellent visibility even in bright ambient light. Both displays feature a high contrast ratio and wide operating temperature range. Mass production of all six of the new 5.7" displays began in August 2016.
New versions of the PointLED and Firefly LEDs are Osram Opto Semiconductors’ latest additions to its portfolio for use in wearables applications such as fitness tracking and health monitoring. With greater brightness, the PointLEDs in true green boast better signal performance and battery life than comparable solutions. The Firefly E 1608 in true green has similar performance and a smaller footprint than industry standard products. The Firefly E 1608 in hyper red has a special narrow-band wavelength range of approximately 660 nm, so it also offers optimized signal recognition. It is suitable for measuring oxygen levels in blood, while the true green PointLEDs are targeted for use in pulse monitors. In true green, the PointLED offers greater brightness of 1,800 to 2,800 mcd at 20 mA. It provides an improved signal in fitness trackers with a higher output compared with earlier versions.
Custom designs can be produced or the products can come preconfigured with integrated sensors such as the SFH 7050. The PointLED is fully available now, while the Firefly E1608 is available for first customer projects with volume start-up planned for early 2017.
Analog Devices' highly integrated HMC8100 and HMC8200 Rx/Tx converters claim significant improvement in reliability for microwave and millimeter wave mobile operators and telecom equipment manufacturers. The converters incorporate an array of functions, replacing multiple discrete parts to provide a single-source solution for microwave backhaul applications.
The HMC8100 IF receiver chip converts RF input signals ranging from 800 to 4,000 MHz down to a single-ended IF signal of 140 MHz at its output. The device includes two voltage gain amplifiers, three power detectors, a programmable automatic gain control block, and select integrated bandpass filters with 14, 28, 56 and 112 MHz bandwidth. The HMC8100 supports all standard microwave frequency bands from 6 to 42 GHz.
The HMC8200 IF transmitter chip converts the 300 to 400 MHz IF input signal to an 800 to 4,000 MHz single-ended RF signal at its output. With IF input power ranges from −31 to +4 dBm, the HMC8200 provides 35 dB of digital gain control in 1 dB steps while an analog voltage gain amplifier continuously controls the transmitter output power from -20 to +5 dBm.
Available now, the HMC8100 is priced at $19.98 in 40-lead 6 x 6 mm LFCSP, and the HMC8200 is $17.06 in 32-lead 5 x 5 mm KFCSP.
The ADi-SA2X all-in-one industrial box PC from ADLINK includes Intel or AMD processor and offers high TDP graphics card options. The PC supports up to 7 independent displays and are equipped with external, field-removable HDD/SSD/CFast, Wifi (a, b, g, h), two GbE ports, 4 USB 3.0 and 3 USB 2.0 ports.
The computer delivers multiple hardware and software security options that target gaming and retail applications and meet GLI. The 6th generation Intel Core processor-based ARiP for gaming includes: 4K UHD; intelligent iAPI middleware and iDLL (raw mode access) customized for gaming application requirements; and integrated SEMA & SEMA Cloud solutions for connected games and support of sophisticated backend infrastructure. The ADi-SA2X all-in-one industrial box PC is based on the embedded Mini-ITX AmITX-SL-G board, computer-on-modules and fanless systems. Project- and cabinet-specific cable/harnessing adaptation I/O boards and other designs are also available.
With a 9-inch WVGA display, 20 million point record length and 1 GS/s sample rate, TBS2000 Series oscilloscopes from Tektronix capture and display significantly more signal. Signals are analyzed with new on-waveform cursor readouts and 32 automated measurements, each with informative tips. The TekVPI probe interface works with traditional BNC connections, but also enables wide application coverage with the latest active voltage, differential and current probes.
Two and four analog channel models are offered along with 100 and 70 MHz bandwidth models. 15 horizontal grids show 50% more signal. The 2-channel models are highly-portable at 5.8 lbs.
The devices include a USB 2.0 host port on the front panel for data storage along with a USB 2.0 device port on the rear panel for connection to a PC. A Wi-Fi interface provides wireless communications capability 1 support. An LXI compliant 10/100BASE-T Ethernet port supports remote control over LAN. The Courseware function allows students to see lab information on the instrument display. The TBS2000 Series oscilloscopes are also fully compatible with TekSmartLab lab management software for education.
Texas Instruments is expanding the functionality of IoT networks with the availability for mass production of its SimpleLink dual-band CC1350 wireless MCU supporting Sub-1 GHz and BLE connectivity on a single chip. As part of TI’s pin-to-pin and software compatible SimpleLink ultra-low power platform, the new MCU enables movement from a three-chip solution to a single chip. The wireless MCU offers a range of up to 20 km on a coin cell battery for building and factory automation, alarm and security, smart grid, asset tracking, and wireless sensor network applications.
The SimpleLink CC1350 wireless MCU LaunchPad development kit is available to get started, and sensors can be connected to the cloud with the SimpleLink CC1350 SensorTag demo kit supported by TI’s Code Composer Studio IDE and IAR Embedded WorkBench. Software options include point-to-point communication examples with EasyLink, a wireless M-Bus protocol stack leveraging TI RTOS, and the BLE-Stack 2.2 SDK which supports Bluetooth 4.2 specifications.
The SimpleLink CC1350 LaunchPad kit costs $29. The CC1350 SensorTag demo kit, coming in 4Q 2016, is priced at $29.99. The SimpleLink CC1350 wireless MCUs available now are for 868, 915 and 920 MHz ISM band operation, and the 7 x 7 mm pricing is $4.60 each/1,000.
Whether you're looking for re-timers or audio codecs, Electronic Design has you covered. We've rounded up some of the latest products to help optimize your applications, devices, and systems.
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