Aug. 21, 2023 - Electronic Design Today

Basic-connectivity PHY-level interfaces developed by Microchip drive the “Ethernet-ization” of vehicles.

Is sharing this type of information part of your collaboration regime?

Input-referred calculations are a valuable tool to understand the expected performance of a measurement system, helping to optimize designs and inform system specifications.

Will rising EV demand trigger a global copper shortage? Can mixed-signal Spice accelerate power product development and still tame those pesky sand worms? Tune in to this month...

The new memory module, one of the components within a 2-TB Pooled CXL Memory System, takes on the challenges wrought by AI and ML.

By combining optical trapping and frequency combs—two widely used but unrelated developments in advanced physics—researchers devised a way to measure micro-dimensions in opaque...

Reaching speeds of 8 PFLOPS, the new Superchip offers 3X more memory bandwidth and runs models 3.5X larger than the previous HBM3 version.

SK Hynix aims to start mass production of its first 300-layer 3D NAND memory by early 2025.

This article discusses which parameters to consider in buck-converter design, the mathematics that should be followed when choosing a transformer, and how these parameters influence...

As vehicles become more advanced and software-centric, automakers should embrace using FPGA chips throughout the design and production phases.

Every power-switching device needs a properly tailored driver for optimum performance—this 2/3-A, 1,200/1,700-V driver from ST is intended for mid-power GaN devices.

Resistive RAM, a non-volatile memory, brings higher performance and lower costs to the table.

The Rohde & Schwarz eCall portfolio supports early testing of new 5G next-generation eCall systems with the CMX500 one-box tester.

Part 2 goes further into the methods that can help lower EMI in switched-cap designs, including implementation of active EMI filters and visible light communication.

According to the research team leader, making it happen meant having to “push the boundaries in materials, manufacturing, thermal management, structures and rotordynamics, and...