Sept. 20. 2021 - Electronic Design Today

The third and final part of this Q&A series with Mahindra Racing features Alexander Sims, one of the team's drivers.

This article discusses different types of motors, basic motor-driver parameters, and specific design requirements to consider when searching for the ideal motor driver for a host...

AI models have demonstrated impressive results in experiments, but deploying them in real-world applications requires combining neural networks with pre- and post-processing steps...

How can today's wireless systems best meet user expectations? Resonant's Mike Eddy weighs in on that question and provides insight into the company's new RF filter that leverages...

The types of chips used in automotive, medical, aerospace and defense, and other sectors require higher levels of safety—with industry standards such as ISO 26262—and long-term...

These rail-to-rail CMOS op amps are specifically designed to maintain their performance in high-EMI environments.

Sponsored by Texas Instruments: MEMS-based DLP® offers resolution equivalent to four 1080p displays for projectors and many other apps. New 2nd-generation chipsets help facilitate...

Xilinx's Versal chips combine hard-core Arm CPUs, AI accelerators, DSP engines, and the same type of programmable logic in its field-programmable gate arrays (FPGAs). Now the ...

With our nation’s hard infrastructure, there’s a growing need for battery-powered, AI-enabled remote wireless devices that communicate bidirectionally, helping decision makers...

Sony recently released its IMX459 stacked SPAD depth sensor.

Modern PCB manufacturing trends require designers to keep tabs on multiple design rules and components. Some manufacturers try to compel designers to apply every rule in their...

First of a three part series examining the OpenVPX architecture