Centered on a Sony chipset, Telit Cinterion’s ME310M1-W1 IoT module paves the way for global deployment opportunities for next-generation cellular LPWANs.
Sponsored by Texas Instruments: Integrating AI into devices on the edge can be simplified with NPU-enhanced MCUs and having the right tools at your fingertips.
The SARA-S528NM10 expands the company’s cellular portfolio for the satellite IoT market, based on the 3GPP Rel 17 specification for global connectivity.
This article takes readers through the basics of industrial automation, the smart factory, and Industry 4.0, while discussing the importance of power and connectivity in smart...