APEC 2023

Here's another dose of the latest new products from the show floor at this week's Applied Power Electronics Conference in Orlando.

While SiC MOSFETs take over more of the power market, the silicon IGBT still has its place.

The compactness of a new series of SiC FET in TOLL packages gives a boost to power density.

The company’s manufacturing milestone represents the start of commercialization and technology integration with key product and semiconductor partners.

Here are some of the new products catching our attention on the show floor at the Applied Power Electronics Conference in Orlando.

TI is highlighting its new 650-V GaN half-bridge IC for power adapters at APEC 2023.

1.5-MHz current sensors support fast-switching SiC and GaN power stages in data centers, motor drives and inverters, and EV batteries and charging infrastructure.

These EMI filter ICs enable engineers to design smaller, lighter, and more affordable power supplies while optimizing system performance, efficiency, and reliability.

On display at APEC, the new GaN power IC is designed for USB Type-C PD adapters that support up to 100 W.

The AOZ13937DI sink and AOZ15333DI source protection switches pave the way for USB Type-C EPR 3.1 designs delivering up to 140 W.

Infineon is seeking to expand its power electronics ecosystem through an acquisition of rival GaN Systems.

By using a step-down switching buck regulator to support two low-dropout regulators, this module provides exceptionally low noise and high power-supply rejection ratio.