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One of the biggest semiconductor engineering challenges is delivering best-in-class devices while dealing with the technology scaling and cost limitations of monolithic IC design processes. To overcome these challenges, more companies are turning to heterogeneous integration and the 3D stacking of ICs and specialized chiplets into 3D ICs. In heterogeneous designs, chips and chiplets are stacked and interconnected with vertical wiring. Designers can also combine them with 3D memory stacks, such as high bandwidth memory, on a silicon interposer within the package of a device.
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This IC integrates one boost converter, one inverting buck-boost converter, two gate-driver supplies, and a boost/SEPIC controller that can power one to six strings of LEDs in...
The RC191xx (RC19108, RC19104, and RC19102) ultra-high performance fanout buffers support PCIe Gen1-7. They provide a Loss-Of-Signal (LOS) output for system monitoring and redundancy...