Overcome the challenges of technology scaling and monolithic IC design process cost limitations. Download our new ebook on delivering 3D IC innovations faster:
One of the biggest semiconductor engineering challenges is delivering best-in-class devices while dealing with the technology scaling and cost limitations of monolithic IC design processes. To overcome these challenges, more companies are turning to heterogeneous integration and the 3D stacking of ICs and specialized chiplets into 3D ICs. In heterogeneous designs, chips and chiplets are stacked and interconnected with vertical wiring. Designers can also combine them with 3D memory stacks, such as high bandwidth memory, on a silicon interposer within the package of a device.
Learn how to engineer a smarter future faster by downloading this ebook.
The TPS62883-Q1 buck converter delivers up to 30A, supports stackable architectures for over 100A, and meets ASIL D functional safety standards for ADAS. Its high accuracy, flexible...
RECOM's RPL-3.0 series is a DC/DC converter in a compact 3mm x 3mm x 1.45mm ten-pad LGA package. It has an input range of 3VDC to 18VDC and the output voltage can be set with ...
Radio frequency (RF) circuits are proliferating in both wired and wireless communications, including Wi-Fi and various wireless technologies being used for the Internet of Things...
