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One of the biggest semiconductor engineering challenges is delivering best-in-class devices while dealing with the technology scaling and cost limitations of monolithic IC design processes. To overcome these challenges, more companies are turning to heterogeneous integration and the 3D stacking of ICs and specialized chiplets into 3D ICs. In heterogeneous designs, chips and chiplets are stacked and interconnected with vertical wiring. Designers can also combine them with 3D memory stacks, such as high bandwidth memory, on a silicon interposer within the package of a device.
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As ADAS technology extends to critical, time-sensitive applications such as emergency braking, front-collision warning and avoidance, and blind-spot detection combining data...
This presentation will provide an overview on proper fan selection, including system profiling, determining a system’s cooling requirements, and an outline of fan types and features...
This video delves into the basics of ultrasonic sensors, including how they work, understanding beam angles, a comparison of strengths and limitations, and more.
View the TI TIDEP-01027 reference design block diagram, schematic, bill of materials (BOM), description, features and design files and start designing.
