Heat Convection Yields Integrated CMOS MEMS Accelerometer

July 9, 2001
Designers can use resistive IC-based thin-film microheating elements to manufacture relatively low-cost integrated MEMS accelerometers in a standard CMOS process. This novel method, developed by the National Institute of Standards and Technology in...

Designers can use resistive IC-based thin-film microheating elements to manufacture relatively low-cost integrated MEMS accelerometers in a standard CMOS process. This novel method, developed by the National Institute of Standards and Technology in Gaithersburg, Md., offers cost, system robustness, and adaptability advantages over conventional MEMS accelerometers, most of which use a solid proof mass.

The new accelerometer works on the principle of heat convection. MEMS project leader Michael Gaitan of NIST's Semiconductor Electronics Division says it uses micromachined thermopiles or thermistors separated by a gap for temperature sensing (see the figure). Heated wires are placed in a gas that's encapsulated in glass and hermetically sealed to prevent any external air flow or pressure changes.

Accelerometers made in this fashion have a small linearity error of less than 0.5% under tilt conditions of ±90°, and less than 2% for accelerations of 7 g or less (1 g = 9.81 ms/s2). Good sensitivity, which is nearly a linear function of heater power, also was achieved. For operating power of about 100 mW, 115 µV/g was measured for thermopiles. A 25-µV/g sensitivity was measured for thermistors as well. Both types of devices can operate up to several hundred hertz, versus tens of hertz for other convection-type accelerometers.

A standard CMOS process provides the miniaturization inherent in high levels of integration. It allows the low-cost integration of the sensing element, drive, detection, and output circuitry on the same substrate.

A suspended polysilicon microheater is the heart of the accelerometer. The thermal difference between the heated element and the surrounding gas generates a buoyant force that causes a convective flow of the encapsulated gas. Under acceleration, the change in the convective flow causes a temperature difference between the two sides of the heated element. This difference is proportional to the acceleration.

Contact Michael Gaitan at (310) 975-2070 or at [email protected]. Velkjo Milanovic, another team member, has left NIST to develop this device commercially at the Adriatic Research Institute, a nonprofit organization in Berkeley, Calif. Go to www.adriaticresearch.com for information about ARI's work.

About the Author

Roger Allan

Roger Allan is an electronics journalism veteran, and served as Electronic Design's Executive Editor for 15 of those years. He has covered just about every technology beat from semiconductors, components, packaging and power devices, to communications, test and measurement, automotive electronics, robotics, medical electronics, military electronics, robotics, and industrial electronics. His specialties include MEMS and nanoelectronics technologies. He is a contributor to the McGraw Hill Annual Encyclopedia of Science and Technology. He is also a Life Senior Member of the IEEE and holds a BSEE from New York University's School of Engineering and Science. Roger has worked for major electronics magazines besides Electronic Design, including the IEEE Spectrum, Electronics, EDN, Electronic Products, and the British New Scientist. He also has working experience in the electronics industry as a design engineer in filters, power supplies and control systems.

After his retirement from Electronic Design Magazine, He has been extensively contributing articles for Penton’s Electronic Design, Power Electronics Technology, Energy Efficiency and Technology (EE&T) and Microwaves RF Magazine, covering all of the aforementioned electronics segments as well as energy efficiency, harvesting and related technologies. He has also contributed articles to other electronics technology magazines worldwide.

He is a “jack of all trades and a master in leading-edge technologies” like MEMS, nanolectronics, autonomous vehicles, artificial intelligence, military electronics, biometrics, implantable medical devices, and energy harvesting and related technologies.

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