Heat Sinks Tackle Low Air Flow Conditions

June 2, 2005
A new line of low-profile, high-performance, heat sinks are designed for cooling hot components in low airflow velocity conditions. The blueICE heat sinks measure 4 mm to 7 mm in height, which allows them to be used inside most telecommunications

A new line of low-profile, high-performance, heat sinks are designed for cooling hot components in low airflow velocity conditions. The blueICE heat sinks measure 4 mm to 7 mm in height, which allows them to be used inside most telecommunications enclosures where space is limited. Their thermal resistance is as low as 1.23°C/W within an air velocity of 600 ft/min. Weight of the heat sinks ranges from 4 to 30 grams. No mechanical hardware is needed to mount the heat sink to a component; a double-sided, thermally conductive, adhesive tape can be used to attach it securely. Prices start at less than $10 each in high volume orders. For more information, contact Norman Quesnel, ADVANCED THERMAL SOLUTIONS, Norwood, MA. (781) 769-2800.

Company: ADVANCED THERMAL SOLUTIONS

Product URL: Click here for more information

About the Author

Staff

Articles, galleries, and recent work by members of Electronic Design's editorial staff.

Sponsored Recommendations

Comments

To join the conversation, and become an exclusive member of Electronic Design, create an account today!