The MODUL R connector from Amphenol were created in response to the electronic packaging evolution requiring advanced features in terms of resistance, size and weight reduction along with easy maintenance and modularity.
This onnector meets the needs of the electronic packaging architecture evolution towards more modularity. Modul R can adapt itself to customer needs regardless of the nature, the function of the card, or the box.
Key features of the connector include:
· Modularity and high performance with 6U&3U formats for all size packaging adaptation and large range of modules: high speed (to 15 GB/s transmission), high density, signal, power (10, 36 and 70A) to be configured according to specific needs.
· High resistance to harsh environments with ruggedized mechanical interface (shocks and vibration) and an EMI (electro magnetic interference) protection -Compatibility with thermal clamps offering a ± 0.4mm lateral displacement
Currently dual source, this new connector will be standardized within the framework of European projects (CORAC, GENOME, IDEE5, Primae ...).
