Wire-to-Board Sub-Miniature Size Connector Suit LED Apps

June 25, 2014
The LEX Series wire-to-board, crimp style, disconnectable connectors from JST offer subminiature size and reliable contact construction for high density applications.

The LEX Series wire-to-board, crimp style, disconnectable connectors recently introduced by JST Corp. offer subminiature size and reliable contact construction for high density applications. These 2.5 mm (.098 in.) pitch, bottom entry, SMT connectors are polarized and have a positive locking feature when mating to headers including an audible click when mated. Ideally suited for low current, low voltage conditions such as in LED light applications, it's designed for maximum pcb flexibility with a mated height of only 3.0 mm (.118") and will not interfere with the luminescence angle of the pcb mounted LED dies.

The LEX crimp style connector series is available in 2 and 4 circuits with a 3.0 A (AC/DC) rating using a 22 AWG wire at 300 V AC/DC. Wire sizes AWG # 22 to 30 are accommodated. Temperature range is -55 °C to +105 °C including temperature rise in applying electrical current. Headers are molded from Halogen free, RoHS compliant 94V-0 resin and feature insertion guides for easy and secure mating.

The LEX Series uses the SFH contacts designed to accommodate a wire range of 22 AWG to 30 AWG and are tin-plated over a phosphor bronze base material. The box construction ensures stable contact performance, redundant contact points, positive electrical contact and low contact resistance at all times when subjected to vibration and distortion.

Contacts are offered on standard size reels for semi-automatic or fully automatic application tooling. SMT headers are provided on embossed tape for automatic insertion equipment.

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