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TE and Molex Set Dual Source Alliance for High-Speed Backplane Connectors

Nov. 22, 2016
Molex and TE Connectivity announced a Dual Source Alliance agreement to produce a new generation of high-speed I/O and backplane connectors for data communications applications.

Molex and TE Connectivity announced a Dual Source Alliance (DSA) agreement to produce a new generation of high-speed input/output (I/O) and backplane connectors for data communications applications. Both companies will collaborate on the launch and marketing of new connector and cable assembly products that enable the growing number of high-speed applications required as data centers evolve with hyperscale models and increased virtualization. This is a major development from two leaders in the connector industry. 

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