Packaging & Interconnects: RF Center-Probe Test Socket Accepts 14- To 27-mm2 Devices

May 24, 2004
A new RF center-probe test socket accepts devices from 14 to 27 mm2. It's designed for pitches down to 0.5 mm and speeds from 1 to over 10 GHz in CSPs, MicroBGAs, MLFs, QFNs, and LGAs. A four-point spring probe crown ensures "scrubbing"...

A new RF center-probe test socket accepts devices from 14 to 27 mm2. It's designed for pitches down to 0.5 mm and speeds from 1 to over 10 GHz in CSPs, MicroBGAs, MLFs, QFNs, and LGAs. A four-point spring probe crown ensures "scrubbing" on solder-ball oxides for reliable contact mating. A 0.077-mm signal path minimizes signal losses. Features include a 500,000-cycle contact life, a force of 9 to 12 g per contact for 0.50- to 0.75-mm pitches and 17 to 20 g per contact for 0.80-mm pitches and higher, and an operating-temperature range of −55°C to 150°C. For a 3.5-GHz, 200-lead socket, pricing starts at $500 each. Lead time is two weeks.

Aries Electronics Inc.www.arieselec.com
(908) 996-6841

About the Author

Roger Allan

Roger Allan is an electronics journalism veteran, and served as Electronic Design's Executive Editor for 15 of those years. He has covered just about every technology beat from semiconductors, components, packaging and power devices, to communications, test and measurement, automotive electronics, robotics, medical electronics, military electronics, robotics, and industrial electronics. His specialties include MEMS and nanoelectronics technologies. He is a contributor to the McGraw Hill Annual Encyclopedia of Science and Technology. He is also a Life Senior Member of the IEEE and holds a BSEE from New York University's School of Engineering and Science. Roger has worked for major electronics magazines besides Electronic Design, including the IEEE Spectrum, Electronics, EDN, Electronic Products, and the British New Scientist. He also has working experience in the electronics industry as a design engineer in filters, power supplies and control systems.

After his retirement from Electronic Design Magazine, He has been extensively contributing articles for Penton’s Electronic Design, Power Electronics Technology, Energy Efficiency and Technology (EE&T) and Microwaves RF Magazine, covering all of the aforementioned electronics segments as well as energy efficiency, harvesting and related technologies. He has also contributed articles to other electronics technology magazines worldwide.

He is a “jack of all trades and a master in leading-edge technologies” like MEMS, nanolectronics, autonomous vehicles, artificial intelligence, military electronics, biometrics, implantable medical devices, and energy harvesting and related technologies.

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