Dual-Sided Fine-Pitch Packages Blend Performance, Cost Benefits

April 14, 2003

The high performance of array packages combined with the low cost of lead frames can be found in the dual fine-pitch no-leads DFN and enhanced DFN+ packages. Advanced Interconnect Technologies' (AIT) DFN and DFN+ permit passive-component integration on two open sides of the lead frame. Both target cell phones, portable computers, PDAs, and automotive systems that require top performance in a small footprint with low manufacturing costs.

"These packages eliminate gull-wing leads that can act as noise-creating antennas and mechanically induced defects caused by coplanarity," explains AIT technical support manager Frank Jusky, whose background includes years of packaging experience at Motorola and Amkor. Thermal and electrical performance exceeds those of laminate packages. Exposed die remove heat directly, and low 0.75- or 0.90-mm profiles mean faster signal speeds. A high-contrast black background improves lead alignment for optical SMT equipment.

"We can handle 0402 and 0201 standard passive component sizes," notes Jusky. "And cost savings can be 20% to 30% over conventional IC packages."

Advanced Interconnect Technologies
www.advancedinterconnect.com • [email protected] • (925) 426-3100

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About the Author

Roger Allan

Roger Allan is an electronics journalism veteran, and served as Electronic Design's Executive Editor for 15 of those years. He has covered just about every technology beat from semiconductors, components, packaging and power devices, to communications, test and measurement, automotive electronics, robotics, medical electronics, military electronics, robotics, and industrial electronics. His specialties include MEMS and nanoelectronics technologies. He is a contributor to the McGraw Hill Annual Encyclopedia of Science and Technology. He is also a Life Senior Member of the IEEE and holds a BSEE from New York University's School of Engineering and Science. Roger has worked for major electronics magazines besides Electronic Design, including the IEEE Spectrum, Electronics, EDN, Electronic Products, and the British New Scientist. He also has working experience in the electronics industry as a design engineer in filters, power supplies and control systems.

After his retirement from Electronic Design Magazine, He has been extensively contributing articles for Penton’s Electronic Design, Power Electronics Technology, Energy Efficiency and Technology (EE&T) and Microwaves RF Magazine, covering all of the aforementioned electronics segments as well as energy efficiency, harvesting and related technologies. He has also contributed articles to other electronics technology magazines worldwide.

He is a “jack of all trades and a master in leading-edge technologies” like MEMS, nanolectronics, autonomous vehicles, artificial intelligence, military electronics, biometrics, implantable medical devices, and energy harvesting and related technologies.