Stacked Memory Socket Houses FS CSP336s

Jan. 1, 2004
Designed for Intel's 0.65-mm pitch FS CSP336 stacked ICs, the SG-BGA-7022 memory socket specifies a 10 GHz bandwidth and a contact resistance of 10 m?. The socket features a precision design that guides the IC to the exact position for connection of

Designed for Intel's 0.65-mm pitch FS CSP336 stacked ICs, the SG-BGA-7022 memory socket specifies a 10 GHz bandwidth and a contact resistance of 10 m?. The socket features a precision design that guides the IC to the exact position for connection of each ball and uses an aluminum heat sink screw to provide compressive force. Mechanically mounted to the target PCB, users twist the socket lid open, insert the IC, close the lid, and rotate the aluminum heat sink screw to provide downward force. A removable IC frame at the top of the socket, which matches the height of the top memory chip, distributes force evenly. Pricing is $434.25 each/100. IRONWOOD ELECTRONICS, Eagan, MN. (800) 404-0204.

Company: IRONWOOD ELECTRONICS

Product URL: Click here for more information

About the Author

Staff

Articles, galleries, and recent work by members of Electronic Design's editorial staff.

Sponsored Recommendations

Comments

To join the conversation, and become an exclusive member of Electronic Design, create an account today!