Packaging & Interconnects: BGA SMT Emulation Adapter Set Aimed At Xilinx FF1152 ICs

March 31, 2005

The female SF-BGA1152A-B-42 socket and the LS-BGA1152A-41 ball-grid-array (BGA) surface-mount (SMT) male pin unit serve as a low-cost and reliable adapter set for Xilinx's 1152-pin BGA ICs. The Giga-snaP feet adapter pair consists of the female socket with the machined pin's epoxy molded over it. The adpater set has the same solder-ball types as the ICs they're emulating. Mating force is only 56 lb (248 Newtons), and the physical length from the top connection point on the male adapter to the solder ball on the female socket is only 4.5 mm. The female socket costs $280 each and the male pin is $120 each, both in single quantities. Both are available now.

Ironwood Electronicswww.ironwoodelectronics.com; (800) 404-0204

About the Author

Roger Allan

Roger Allan is an electronics journalism veteran, and served as Electronic Design's Executive Editor for 15 of those years. He has covered just about every technology beat from semiconductors, components, packaging and power devices, to communications, test and measurement, automotive electronics, robotics, medical electronics, military electronics, robotics, and industrial electronics. His specialties include MEMS and nanoelectronics technologies. He is a contributor to the McGraw Hill Annual Encyclopedia of Science and Technology. He is also a Life Senior Member of the IEEE and holds a BSEE from New York University's School of Engineering and Science. Roger has worked for major electronics magazines besides Electronic Design, including the IEEE Spectrum, Electronics, EDN, Electronic Products, and the British New Scientist. He also has working experience in the electronics industry as a design engineer in filters, power supplies and control systems.

After his retirement from Electronic Design Magazine, He has been extensively contributing articles for Penton’s Electronic Design, Power Electronics Technology, Energy Efficiency and Technology (EE&T) and Microwaves RF Magazine, covering all of the aforementioned electronics segments as well as energy efficiency, harvesting and related technologies. He has also contributed articles to other electronics technology magazines worldwide.

He is a “jack of all trades and a master in leading-edge technologies” like MEMS, nanolectronics, autonomous vehicles, artificial intelligence, military electronics, biometrics, implantable medical devices, and energy harvesting and related technologies.