Taking some of the complexity out of mobile-phone design, the company's 4-GB multi-chip package (MCP) memory eliminates both the need for an external memory-card slot and the task of developing interface software for all types of NAND memory. Defined as an embedded moviNAND memory solution, the moviMCP combines a 4-GB embedded memory card consisting of two 16-Gb NAND-flash chips and a controller, together with a 1-Gb mobile DRAM chip to support the processor and a 2-Gb NAND-flash chip for general handset operations. This provides a total memory capacity of 35 Gb. The moviMCP is currently available for OEM sampling. SAMSUNG ELECTRONICS CO. LTD., San Jose, CA. (800) 726-7864.
Company: SAMSUNG ELECTRONICS CO. LTD.
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