USB Transceiver Trims Board Space Thanks To Micro-Leadframe

July 7, 2003
Almost 84% smaller than comparable TSSOP or SOIC packages, the USB1T11ABQ USB transceiver comes in a micro-leadframe package. The micro-leadframe considerably reduces the amount of board space needed by the USB interface. As a result,...

Almost 84% smaller than comparable TSSOP or SOIC packages, the USB1T11ABQ USB transceiver comes in a micro-leadframe package. The micro-leadframe considerably reduces the amount of board space needed by the USB interface. As a result, space-constrained devices such as cell phones, PDAs, and digital cameras can include USB connectivity without penalizing board area. The transceiver interfaces 5.0- or 3.3-V programmable logic to the USB physical layer and supports both the 1.5- and 12-Mbit/s data rates in the USB 1.1 specification. In lots of 1000 units, the USB1T11ABQ costs $0.65 each, with samples immediately available.

Fairchild Semiconductor Internationalwww.fairchildsemi.com; (888) 522-5372

About the Author

Dave Bursky | Technologist

Dave Bursky, the founder of New Ideas in Communications, a publication website featuring the blog column Chipnastics – the Art and Science of Chip Design. He is also president of PRN Engineering, a technical writing and market consulting company. Prior to these organizations, he spent about a dozen years as a contributing editor to Chip Design magazine. Concurrent with Chip Design, he was also the technical editorial manager at Maxim Integrated Products, and prior to Maxim, Dave spent over 35 years working as an engineer for the U.S. Army Electronics Command and an editor with Electronic Design Magazine.

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