Partnership Forecasts Unique FPGA Packaging

Announced as the first cooperative agreement of its kind in the programmable logic industry, White Electronic Designs will be teaming with Altera to create a broad variety of packaging options for FPGAs that meet the requirements of defense and aerospace applications. White Electronic will wrap Altera FPGA die in package types that include small form-factor monolithic plastic and ceramic, chip-on-board, multichip modules, stack, and system-in-a-package. Options will support 90-nm Stratix II and Cyclone II FPGA families while support for next-generation, 65-nm devices looms on the horizon. WHITE ELECTRONIC DESIGNS CORP., Phoenix, AZ. (602) 437-1520.