Advanced Stacking Technology Combines Dissimilar Components Into Chipsets

Using its LP-Stack technology, the company claims it is now capable of stacking different, dissimilar components for a fully integrated system chipset that can increase functionality and reduce board space. It also claims to be the first to apply a high-volume advanced stacking technology to combining DSPs, ASICs, PLDs, memory and other logic components, each with different package size, pin count, or pin pitch. It is said that being able to stack dissimilar components will allow manufacturers shorten development cycles, reduce their development costs, and provide incremental performance enhancements without requiring the next generation chips.