Designed for the Texas Instruments TMS320C6x DSP family, the EDI9LC644-BC module combines 128k x 32 of synchronous SRAM and 1M x 32 of synchronous DRAM in a BGA153 package. It provides high-speed external memory for each of the DSPs’ memory interface ports.Through use of MCM-L technology, the module delivers a 66% space saving and improved performance compared with monolithic approaches, it’s claimed. Performance improvements are based on lessened capacitance and inductance compared with conventional packages. The device also reduces the number of active signal connections required on the system board by 50%. SRAM speeds range to 200 MHz; DRAM speeds are as high as 125 MHz.
Company: WHITE ELECTRONIC DESIGNS CORP.
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