Substrate Technology Boosts Thermal Conductivity

March 21, 2006
The company's substrate technology, dubbed Anotherm, promises significant benefits over conventional polymer-based insulated metal substrates (IMS). The substrate consists of a thermally conductive aluminum alloy substrate insulated by a thin,

The company's substrate technology, dubbed Anotherm, promises significant benefits over conventional polymer-based insulated metal substrates (IMS). The substrate consists of a thermally conductive aluminum alloy substrate insulated by a thin, chemically grown anodized dielectric layer with solderable screen-printed conductors on the anodized layer. In contrast to IMS, the Anotherm process chemically converts the surface of the base aluminum to an anodized insulating layer with a uniform thickness of 35 µm. It also entails an additive process that requires fewer process steps than the subtractive process typically used for IMS board manufacturing. Maximum operating voltage for the substrate is 250 Vac with a thermal impedance at 0.2°C/W. Maximum continuous operating temperature is 400°C without a solder maskant and 175°C with a solder maskant. For further information, pricing, and availability, call IRC INC., Corpus Christi, TX. (361) 992-7900

Company: IRC INC.

Product URL: Click here for more information

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