Heat Sink Assemblies Use Less Space, Improve Cooling

To improve thermal performance while minimizing board real estate, the superGRIP assemblies incorporate a heat sink, phase-change interface material, and a unique attachment system for quick and secure mounting onto a wide range of BGA components. The attachment system uses a plastic frame clip that fastens around the perimeter of a component and a metal spring clip that slips through a heat sink’s fin field and locks to both ends of the plastic frame. The superGRIP assemblies feature the maxiFLOW heat sinks, which have a low profile, spread-fin architecture to maximize surface area for more effective convection (air) cooling. Testing at an air flow rate of just 0.5 m/s (100 ft./min.) shows that device junction temperatures can be reduced by more than 20% below the temperatures achieved using heat sinks with traditional fin styles. The assemblies come in 51 versions to fit 17 component sizes between 15 by 15 mm and 45 by 45 mm. Heat sinks are available in heights of 7.5 mm, 12.5 mm, and 17.5 mm. The superGRIP attachment system is also available with straight-fin and cross-cut heat sinks, and in custom designs. ADVANCED THERMAL SOLUTIONS INC., Norwood, MA. (781) 769-2800.