10-GHz Sockets Support Dense MLF Devices

When socketing 0.5-mm pitch micro lead-frame (MLF) (QFN, MLP, LPCC, QLP, HVQFN, and LFCSP) ICs, performance degradation usually enters the picture. A new series of zero insertion force (ZIF) sockets squashes these problems. The 10-GHz sockets utilize a conductive elastomer contactor to support very dense MLF devices. Using an aluminum heatsink screw to provide compressive force, the socket guides the IC to the exact position for connection of each lead. It's mechanically mounted to the target pc board. The socket lid is twisted open, and the IC is inserted. Once the lid is closed, the aluminum heatsink screw is rotated to exert downward force on the IC. With a profile of 5 mm, the sockets measure 2.5 mm larger per side than the actual IC packages. This configuration minimizes footprint on system boards while maximizing system speeds. The socket body is constructed of aluminum to facilitate heatsinking. Applications for the device include high-speed communications and computing. The first socket in the series, the 10-mm body size SG-MLF-7000 socket, costs $510 each in 100-unit quantities.

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