Module Integrates 3D Time-of-Flight Sensor

Aug. 8, 2022
Analog Devices' Erik Barnes shows off a power-efficient, 1-Mpixel, 3D ToF sensor module.

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3D time-of-flight (ToF) sensors provide fast, 3D vision systems for machine vision, robots, building-automation systems, and augmented-reality systems. Along those lines, Analog Devices packed its 3D ToF platform into a compact module, the ADTF3175 (Fig. 1).

In the video, Erik Barnes shows off the power-efficient, 1-Mpixel, 3D TOF sensor in the company's eval module. The module is built into a custom, handheld capture system.

The ADTF3175 chip has 1k × 1k resolution with a 75-degree field of view (Fig. 2). The imager lens integrates a 940-nm bandpass filter. It has a 4-lane, 1-Gb/s MIPI CSI-2 interface and 2-/4-wire SPI interface. Depth range spans from 0.4 to 4 m with a depth accuracy of 3 mm.  

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