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    Rod Sutton/Construction Equipment
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    Automotive

    Deere Unveils Autonomous Articulated Dump Truck @ ConstructionEquipment.com

    Deere announced its 460 P Tier ADT at CES 2025, but gave us an advanced look at the machine in the field.
    Donut Lab
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    Automotive

    CES 2025 Revs Up with a Sony EV, a Transformer Truck, and In-Wheel Motors

    Andy highlights some new electric-vehicle-related announcements at CES 2025.
    ID 277345526 © Kittipong Jirasukhanont | Dreamstime.com
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    Automotive

    Battery Packaging Architectures: Materials Considerations

    Challenges surrounding battery packaging architecture include dealing with packaging space, thermal management, and optimizing battery-management systems.
    ID 104689982 © Vitalii Holubtsov | Dreamstime.com
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    Analog

    For Designers: Logic Nets in Transistor Cans (ED article from 1961)

    Here’s a blast from the past as we reprint our news from NYC’s 1961 IRE show—the first integrated logic circuits in TO-5 and TO-18 cans are being announced.
    Dreamstime_dtvphoto_115993062
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    Nonlinearities

    So...The CMOS Circuits in Our Texts Go Back to 1963?

    Mostly-Analog editor Andy Turudic takes a look at the original 1963 ISSCC paper that described the world’s first CMOS process with planar P- and N-type MOSFETs.
    ID 341643031 © Sascha Winter | Dreamstime.com
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    Inside Electronics

    How to Handle the Increasing Data Demands on Server-Farm Cabling

    Point2 Technology’s David Kuo explains how e-Tube technology combats the limitations of copper cabling by leveraging mmWave transmitter/receiver SoCs and a dielectric waveguide...
    ID 343923804 © Oleksandra Tsvid | Dreamstime.com
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    Power

    Die-Attach Process Dramatically Improves Waste-Heat Removal in Power Electronics

    A new die-attach process promises to cool power devices up to 15X more efficiently while reducing failure-inducing stresses caused by conventional sintering techniques.
    Electronic Design and Phlux Technology
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    Analog

    Tailoring the Design of Transimpedance Amplifiers to Infrared Sensor Apps (Part 2)

    Part 2 describes TIA applications in fiber-optic communication systems and makes recommendations for designs that are specific to each application in fiber-optic comms.
    Dreamstime
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    The Briefing

    Cadence Rolls Out System Chiplet to Reorganize the SoC

    Learn more about the motivations behind Cadence’s new Arm-based system chiplet in the latest installment of The Briefing.