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    • 67a673588e8df259143ea620 April Webinar Registration Image 2025
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    Obsolescence Management Starts at Design

    As semiconductor fabrication advances and package obsolescence accelerates, legacy system manufacturers face sourcing challenges, rising costs, and supply chain disruptions—yet proactive planning for obsolescence can mitigate risks and reduce long-term support costs.

    April 8, 2025 

    11:00 AM ET / 10:00 AM CT / 8:00 AM PT / 3:00 PM GMT 

    Duration: 1 hour 

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    Summary

    As silicon fabrication technology advances, older fab processes are phased out. At the same time, package obsolescence is accelerating.

    The shift to advanced silicon fabrication nodes reduces the availability of raw materials and equipment for legacy products, causing suppliers to phase out older materials and machinery, which creates sourcing challenges for legacy systems and raises obsolescence risks.

    Changes in assembly techniques and materials accelerate component obsolescence. Manufacturers seeking efficiency and reliability often adopt new assembly processes that are incompatible with older assemblies like PLCC and PQFP.

    Obsolete components can disrupt supply chains, affecting production schedules and complicating the process of sourcing fully authorized replacements. This can lead to added costs for redesign and re-certification, which can strain budgets and impact timelines.

    However, planning for obsolescence at the design and product definition phases can maximize impact, mitigate risk, and help long-term system companies reduce support costs.

    • Learn about the current semiconductor market trends, how component obsolescence affects long-term system markets, and what are the driving factors.
    • Discover the importance of “obsolescence-resistant” design and how to achieve it.
    • Learn about the hidden penalty of date code restrictions.

    Speakers

    Dan Deisz Vice President, Design Technology Rochester Electronics
    Dan Deisz
    Vice President, Design Technology
    Rochester Electronics

    With over 35 years of semiconductor design experience, Dan Deisz is the Vice President of Design Technology at Rochester Electronics, based in Rockville, Maryland. In this role, his group performs all authorized product replications and customer-specific design solutions. Daniel is also an active member of the Anti-Counterfeiting Task Force (ACTF) for the SIA, having trained more than 200 CBP/HSI agents.

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