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    Packaging/Interconnects: Test Socket With RF Center Probe Eliminates Package-Lead Damage

    Nov. 10, 2003
    A high-frequency center-probe test socket features a floating guide plate with a built-in hand stop to protect probes during test and eliminate damage to the package leads. Well suited for automated handler testing in 1- to 10-GHz applications, it...

    A high-frequency center-probe test socket features a floating guide plate with a built-in hand stop to protect probes during test and eliminate damage to the package leads. Well suited for automated handler testing in 1- to 10-GHz applications, it can be used for 0.50-mm pitch (or more) packages in devices up to 55 mm wide. Decoupling pockets of the socket can be placed within 1.0 mm of the probes, enabling users to place biasing or decoupling components right next to the probes. This results in less noise and faster test time. The socket is available in custom materials, platings, sizes, and configurations. A 256-lead 2-GHz package starts at $1464 with six-week delivery.

    Aries Electronics Inc.www.aireselec.com; (908) 996-6841

    About the Author

    Roger Allan

    Roger Allan is an electronics journalism veteran, and served as Electronic Design's Executive Editor for 15 of those years. He has covered just about every technology beat from semiconductors, components, packaging and power devices, to communications, test and measurement, automotive electronics, robotics, medical electronics, military electronics, robotics, and industrial electronics. His specialties include MEMS and nanoelectronics technologies. He is a contributor to the McGraw Hill Annual Encyclopedia of Science and Technology. He is also a Life Senior Member of the IEEE and holds a BSEE from New York University's School of Engineering and Science. Roger has worked for major electronics magazines besides Electronic Design, including the IEEE Spectrum, Electronics, EDN, Electronic Products, and the British New Scientist. He also has working experience in the electronics industry as a design engineer in filters, power supplies and control systems.

    After his retirement from Electronic Design Magazine, He has been extensively contributing articles for Penton’s Electronic Design, Power Electronics Technology, Energy Efficiency and Technology (EE&T) and Microwaves RF Magazine, covering all of the aforementioned electronics segments as well as energy efficiency, harvesting and related technologies. He has also contributed articles to other electronics technology magazines worldwide.

    He is a “jack of all trades and a master in leading-edge technologies” like MEMS, nanolectronics, autonomous vehicles, artificial intelligence, military electronics, biometrics, implantable medical devices, and energy harvesting and related technologies.

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