Gap Filler Improves Thermal Performance

For thermal interface applications where high compliancy is desirable, T-flex 700 thermally-conductive gap filler specifies a thermal conductivity of 5.0 W/mK and accommodates applications where the tolerance stack-up is high and the maximum mechanical stress on the components must be low. The material’s shore hardness value of 50 promises to maintain device reliability when mechanical shock and vibration are important design considerations. Thickness ranges include 1 mm to 5 mm in 0.25-mm increments and the product is available in standard sheets or die cut parts that can be custom made to spec. Another available option is adhesive on only one side. For further information, call LAIRD TECHNOLOGIES, St. Louis, MO. (866) 928-8181.